芯片的外形与封装
Altera Corporation
1
April 2002, ver. 10.2
Data Sheet
Introduction
This data sheet provides the following package information for all Altera ?devices:■Lead materials ■Thermal resistance ■Package weights ■
Package outlines
In this data sheet, packages are listed in order of ascending pin count.
Lead Materials
Table 1 shows the available package types, package acronyms, lead materials, and lead finishes for all Altera device packages.
Notes to Table 1:(1)Solder dip lead finishes are 60/40 typical, and solder plate lead finished are 85/15 typical.
(2)
An industry-standard lead glass called T-187 (lead oxide glass) is used to seal PGA packages. This material is manufactured by the Sumitomo Corporation.
Table 1.Altera Device Lead Materials
Package Type
Package Acronym
Lead Material
Lead Finish (1)
Ceramic dual in-line CerDIP Alloy 42Solder dip Plastic dual in-line PDIP Copper Solder plate Ceramic J-lead chip carrier JLCC Alloy 42Solder dip Plastic J-lead chip carrier PLCC Copper Solder plate
Ceramic pin-grid array (2)PGA Alloy 42Gold over nickel plate Plastic small-outline integrated circuit SOIC Copper Solder plate Plastic quad flat pack PQFP Copper Solder plate Plastic thin quad flat pack TQFP Copper Solder plate Power quad flat pack RQFP Copper
Solder plate Ball-grid array BGA
Tin-lead alloy (63/37)–FineLine BGA TM FineLine BGA Tin-lead alloy (63/37)–Ultra FineLine BGA Ultra FineLine BGA
Tin-lead alloy (63/37)
–
Altera Device
Package Information
Altera Device Package Information Data Sheet
Device & Package Cross Reference Tables2 through 18 show which Altera Stratix TM, APEX TM II, Mercury TM, ARM?-based Excalibur TM, APEX 20KC, APEX20KE, APEX 20K, and ACEX?1K, FLEX 10KA, FLEX? 10KS, FLEX 10KE, FLEX 10KV,
FLEX10K?, FLEX 6000, MAX? 9000, MAX 7000B, MAX 7000AE,
MAX7000A, and enhanced configuration devices are available in BGA, FineLine BGA and Ultra FineLine BGA packages.
Table 2.Stratix Devices in BGA, FineLine BGA & Ultra FineLine BGA Packages
Device Package Pins EP1S10Non-Thermally Enhanced Cavity Up672
Non-Thermally Enhanced FineLine BGA672
Thermally Enhanced FineLine BGA780
EP1S20Non-Thermally Enhanced Cavity Up672
Non-Thermally Enhanced FineLine BGA672
Thermally Enhanced FineLine BGA780
EP1S25Non-Thermally Enhanced Cavity Up672
Non-Thermally Enhanced FineLine BGA672
Thermally Enhanced FineLine BGA780
Thermally Enhanced FineLine BGA1,020 EP1S30Thermally Enhanced FineLine BGA780
Thermally Enhanced BGA Cavity Up956
Thermally Enhanced FineLine BGA1,020 EP1S40Thermally Enhanced BGA Cavity up956
Thermally Enhanced FineLine BGA1,020
Thermally Enhanced FineLine BGA1,508 EP1S60Thermally Enhanced BGA Cavity up956
Thermally Enhanced FineLine BGA1,020
Thermally Enhanced FineLine BGA1,508 EP1S80Thermally Enhanced BGA Cavity Up956
Thermally Enhanced FineLine BGA1,508 EP1S120Thermally Enhanced FineLine BGA1,923
Altera Device Package Information Data Sheet Table 3.APEX II Devices in BGA, FineLine BGA & Ultra FineLine BGA Packages
Device Package Pins EP2A15Thermally Enhanced FineLine BGA672
Thermally Enhanced BGA Cavity Up724
EP2A25Thermally Enhanced FineLine BGA672
Thermally Enhanced BGA Cavity Up724
Thermally Enhanced FineLine BGA1,020 EP2A40Thermally Enhanced FineLine BGA672
Thermally Enhanced BGA Cavity Up724
Thermally Enhanced FineLine BGA1,020 EP2A70Thermally Enhanced BGA Cavity Up724
Thermally Enhanced FineLine BGA1,508 Table 4.Mercury Devices in BGA, FineLine BGA & Ultra FineLine BGA Packages
Device Package Pins EP1M120Thermally Enhanced FineLine BGA484
EP1M350Thermally Enhanced FineLine BGA780 Table 5.ARM-Based Excalibur Devices in BGA, FineLine BGA & Ultra FineLine BGA Packages
Device Package Pins EPXA1Non-Thermally Enhanced FineLine BGA484
Thermally Enhanced FineLine BGA672 EPXA4Thermally Enhanced FineLine BGA672
Thermally Enhanced FineLine BGA1,020 EPXA10Thermally Enhanced FineLine BGA1,020
Altera Device Package Information Data Sheet
Table 6.APEX 20KE Devices in BGA, FineLine BGA & Ultra FineLine BGA
Packages
Device Package Pins
EP20K30E Non-Thermally Enhanced FineLine BGA144
Non-Thermally Enhanced FineLine BGA324
EP20K60E Non-Thermally Enhanced FineLine BGA144
Non-Thermally Enhanced FineLine BGA324
Thermally Enhanced BGA Cavity Down356
EP20K100E Non-Thermally Enhanced FineLine BGA144
Non-Thermally Enhanced FineLine BGA324
Thermally Enhanced BGA Cavity Down356
EP20K160E Thermally Enhanced BGA Cavity Down356
Non-Thermally Enhanced FineLine BGA 484
EP20K200E Thermally Enhanced BGA Cavity Down356
Non-Thermally Enhanced FBGA 484
Non-Thermally Enhanced BGA Cavity Up652
Non-Thermally Enhanced FBGA 672
EP20K300E Non-Thermally Enhanced BGA Cavity Up652
Non-Thermally Enhanced FBGA 672
EP20K400E Thermally Enhanced BGA Cavity Down652
Thermally Enhanced FineLine BGA 672
EP20K600E Thermally Enhanced BGA Cavity Down652
Thermally Enhanced FBGA 672
Thermally Enhanced FBGA 1,020
EP20K1000E Thermally Enhanced BGA Cavity Up652
Thermally Enhanced FineLine BGA 672
Thermally Enhanced FineLine BGA 1,020
EP20K1500E Thermally Enhanced BGA Cavity Up652
Thermally Enhanced FineLine BGA 1,020
Altera Device Package Information Data Sheet Table 7.APEX 20KC Devices in BGA, FineLine BGA & Ultra FineLine BGA Packages
Device Package Pins EP20K200C Thermally Enhanced BGA Cavity Down356
Non-Thermally Enhanced FineLine BGA 484
EP20K400C Thermally Enhanced BGA Cavity Down652
Thermally Enhanced FineLine BGA 672
EP20K600C Thermally Enhanced BGA Cavity Down652
Thermally Enhanced FineLine BGA 672
Thermally Enhanced FineLine BGA 1,020 EP20K1000C Thermally Enhanced BGA Cavity Up652
Thermally Enhanced FineLine BGA 672
Thermally Enhanced FineLine BGA 1,020 Table 8.APEX 20K Devices in BGA, FineLine BGA & Ultra FineLine BGA Packages
Device Package Pins EP20K100Non-Thermally Enhanced FineLine BGA324
Thermally Enhanced BGA Cavity Down356
EP20K200Thermally Enhanced BGA Cavity Down356
Non-Thermally Enhanced FineLine BGA 484
EP20K400Thermally Enhanced BGA Cavity Down652
Thermally Enhanced FineLine BGA 672 Table 9.ACEX 1K Devices in BGA, FineLine BGA & Ultra FineLine BGA Packages
Device Package Pins EP1K10Non-Thermally Enhanced FineLine BGA 256
EP1K30Non-Thermally Enhanced FineLine BGA 256
EP1K50
Non-Thermally Enhanced FineLine BGA 256
EP1K50S
Non-Thermally Enhanced FineLine BGA 484
EP1K50
EP1K50S
EP1K100Non-Thermally Enhanced FineLine BGA 256
Non-Thermally Enhanced FineLine BGA 484
Altera Device Package Information Data Sheet
Table 10.FLEX 10KA & FLEX 10KS Devices in BGA, FineLine BGA & Ultra
FineLine BGA Packages
Device Package Pins
EPF10K10A Non-Thermally Enhanced FineLine BGA 256
EPF10K30A Non-Thermally Enhanced FineLine BGA 256
EPF10K30A Thermally Enhanced BGA Cavity Down356
EPF10K30A Non-Thermally Enhanced FineLine BGA 484
EPF10K50S Non-Thermally Enhanced FineLine BGA 256
EPF10K50S Thermally Enhanced BGA Cavity Down356
EPF10K50S Non-Thermally Enhanced FineLine BGA 484
EPF10K100A Thermally Enhanced BGA Cavity Down356
EPF10K100A Non-Thermally Enhanced FineLine BGA 484
EPF10K100A Thermally Enhanced BGA Cavity Down600
EPF10K200S Thermally Enhanced BGA Cavity Down356
EPF10K200S Non-Thermally Enhanced FineLine BGA 484
EPF10K200S Thermally Enhanced BGA Cavity Down600
EPF10K200S Non-Thermally Enhanced FineLine BGA 672
EPF10K250A Thermally Enhanced BGA Cavity Down600
Table 11.FLEX 10KE Devices in BGA, FineLine BGA & Ultra FineLine BGA
Packages
Device Package Pins
EPF10K30E Non-Thermally Enhanced FineLine BGA 256
EPF10K30E Non-Thermally Enhanced FineLine BGA 484
EPF10K50E Non-Thermally Enhanced FineLine BGA 256
EPF10K50E Non-Thermally Enhanced FineLine BGA 484
EPF10K100E Non-Thermally Enhanced FineLine BGA 256
EPF10K100E Thermally Enhanced BGA Cavity Down356
EPF10K100E Non-Thermally Enhanced FineLine BGA 484
EPF10K130E Thermally Enhanced BGA Cavity Down356
EPF10K130E Non-Thermally Enhanced FineLine BGA 484
EPF10K130E Thermally Enhanced BGA Cavity Down600
EPF10K130E Non-Thermally Enhanced FineLine BGA 672
EPF10K200E Thermally Enhanced BGA Cavity Down600
EPF10K200E Non-Thermally Enhanced FineLine BGA 672
Altera Device Package Information Data Sheet Table 12.FLEX 10K & FLEX 10KV Devices in BGA, FineLine BGA & Ultra FineLine BGA Packages
Device Package Pins EPF10K30Thermally Enhanced BGA Cavity Down356 EPF10K50Thermally Enhanced BGA Cavity Down356 EPF10K50V Thermally Enhanced BGA Cavity Down356 EPF10K50V Non-Thermally Enhanced FineLine BGA 484 EPF10K130V Thermally Enhanced BGA Cavity Down600
Table 13.FLEX 6000 Devices in BGA, FineLine BGA & Ultra FineLine BGA Packages
Device Package Pins EPF6016Non-Thermally Enhanced BGA Cavity Up256 EPF6016A Non-Thermally Enhanced FineLine BGA 100 EPF6016A Non-Thermally Enhanced BGA 256 EPF6024A Non-Thermally Enhanced BGA Cavity Up256 EPF6024A Non-Thermally Enhanced FineLine BGA 256
Table 14.MAX 9000 Devices in BGA, FineLine BGA & Ultra FineLine BGA Packages
Device Package Pins EPM9320Thermally Enhanced BGA Cavity Down356 EPM9320A Thermally Enhanced BGA Cavity Down356 EPM9560Thermally Enhanced BGA Cavity Down356
Altera Device Package Information Data Sheet
Table 15.MAX 7000B Devices in BGA, FineLine BGA & Ultra FineLine BGA
Packages
Device Package Pins
EPM7032B Ultra FineLine BGA49
EPM7064B Ultra FineLine BGA49
EPM7064B Non-Thermally Enhanced FineLine BGA 100
EPM7128B Ultra FineLine BGA49
EPM7128B Non-Thermally Enhanced FineLine BGA 100
Non-Thermally Enhanced BGA 100
EPM7128B Ultra FineLine BGA169
EPM7128B Non-Thermally Enhanced FineLine BGA 256
EPM7256B Ultra FineLine BGA169
EPM7256B Non-Thermally Enhanced FineLine BGA 256
EPM7512B Ultra FineLine BGA169
EPM7512B Non-Thermally Enhanced FineLine BGA 256
EPM7512B Thermally Enhanced BGA Cavity Down256
Table 16.MAX 7000AE Devices in BGA, FineLine BGA & Ultra FineLine BGA
Packages
Device Package Pins
EPM7064AE Ultra FineLine BGA49
Non-Thermally Enhanced FineLine BGA 100
EPM7128AE Non-Thermally Enhanced FineLine BGA 100
Ultra FineLine BGA169
Non-Thermally Enhanced FineLine BGA 256
EPM7256AE Thermally Enhanced BGA Cavity Down256
EPM7256AE Non-Thermally Enhanced FineLine BGA 256
EPM7512AE Thermally Enhanced BGA Cavity Down256
Table 17.MAX 7000A Devices in BGA, FineLine BGA & Ultra FineLine BGA
Packages
Device Package Pins
EPM7128A Non-Thermally Enhanced FineLine BGA 100
Non-Thermally Enhanced FineLine BGA 256
EPM7256A Non-Thermally Enhanced FineLine BGA 256
Altera Device Package Information Data Sheet
Thermal Resistance Tables19 through 32 provide θJA (junction-to-ambient thermal resistance) and θJC (junction-to-case thermal resistance) values for Altera Stratix, APEX II, Mercury, ARM-based Excalibur, APEX20K and APEX 20KE, ACEX1K, FLEX?10K and FLEX 10KE, FLEX8000, FLEX 6000,
MAX?9000, MAX7000, MAX 3000A, Classic TM, and configuration devices.
Table 18.Enhanced Configuration Devices in BGA, FineLine BGA & Ultra FineLine BGA Packages
Device Package Pins EPC16Ultra FineLine BGA88
Table 19.Thermal Resistance of Stratix Devices
Device Pin Count PackageθJC (° C/W)θJA (° C/W)
Still Air θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400 ft./min.
EP1S10672BGA 3.216.813.711.910.5 672FBGA 3.417.21412.210.8
780FBGA0.211.29.17.6 6.4 EP1S20672BGA 2.515.512.410.79.3 672FBGA 2.71612.8119.6
780FBGA0.2118.97.4 6.2 EP1S25672BGA 2.214.811.710.08.7 672FBGA 2.315.31210.49
780FBGA0.210.88.87.2 6.1
1020FBGA0.1510.38.7 6.7 5.6 EP1S30780FBGA0.210.78.67.1 5.9 1020FBGA0.1510.18.1 6.5 5.5
956BGA0.19.37.3 6.0 4.9 EP1S40956BGA0.19.37.2 5.9 4.8 1020FBGA0.1510.18.0 6.5 5.4
1508FBGA0.19.37.3 5.9 4.8 EP1S60956BGA0.19.27.1 5.8 4.7 1020FBGA0.159.97.9 6.4 5.3
1508FBGA0.19.27.1 5.8 4.7 EP1S80956BGA0.19.17.0 5.6 4.6 1508FBGA0.19.17.0 5.6 4.6
Altera Device Package Information Data Sheet Table 20.Thermal Resistance of APEX II Devices
Device Pin
Count PackageθJC (° C/W)θJA (° C/W)
Still Air
θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400 ft./min.
EP2A15672FineLine BGA0.111.69.68.0 6.6 724BGA0.110.08.2 6.6 5.4
EP2A25 EP2A40
672FineLine BGA0.111.59.68.6 6.6 724BGA0.110.08.2 6.6 5.4 1,020FineLine BGA0.110.48.5 6.9 5.7
EP2A70724BGA0.19.77.8 6.2 5.0 1,508FineLine BGA0.19.47.3 5.8 4.7
Table 21.Thermal Resistance of Mercury Devices
Device Pin
Count PackageθJC (° C/W)θJA (° C/W)
Still Air
θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400 ft./min.
EP1M120484FineLine BGA0.313.011.19.37.9 EP1M350780FineLine BGA0.111.09.27.6 6.3
Table 22.Thermal Resistance of Excalibur Embedded Processor Solutions
Device Pin
Count PackageθJC (° C/W)θJA (° C/W)
Still Air
θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400 ft./min.
EPXA1484FineLine BGA 4.020.018.315.813.9 672FineLine BGA0.312.210.28.67.2 EPXA4672FineLine BGA0.111.69.67.9 6.6 1,020FineLine BGA0.110.48.5 6.9 5.7 EPXA101,020FineLine BGA0.110.08.0 6.4 5.2
Table 23.Thermal Resistance of APEX 20K & APEX 20KE Devices (Part 1 of 3)
Device Pin
Count PackageθJC (° C/W)θJA (° C/W)
Still Air
θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400 ft./min.
EP20K30E144TQFP8.029.028.026.025.0 208PQFP 5.030.029.027.022.0
144FineLine BGA14.036.034.032.029.0
324FineLine BGA9.031.029.028.025.0
Altera Device Package Information Data Sheet
EP20K60E
144TQFP 7.028.026.025.024.0144FineLine BGA 11.033.032.030.027.0208PQFP 5.030.028.026.021.0240PQFP 4.026.024.021.017.0324Fineline BGA 7.029.028.026.024.0356
BGA 1.012.011.010.09.0EP20K100144TQFP 7.026.025.024.023.0208PQFP 5.029.027.025.020.0240PQFP 4.025.023.020.017.0324FineLine BGA 6.028.026.025.023.0356
BGA 1.012.011.010.09.0EP20K100E 144TQFP 7.026.025.024.023.0144FineLine BGA 9.032.030.029.026.0208PQFP 5.029.027.025.020.0240PQFP 4.025.023.020.017.0324FineLine BGA 6.028.026.025.023.0356
BGA 1.012.011.010.09.0EP20K160E 144TQFP 6.025.024.023.022.0208PQFP 5.028.026.023.019.0240PQFP 4.024.021.019.016.0356BGA
1.01
2.011.010.09.0484
FineLine BGA 5.024.023.022.021.0EP20K200208PQFP 4.025.023.020.017.0240PQFP 3.021.019.017.015.0356BGA
1.01
2.011.010.09.0484
FineLine BGA 5.022.021.020.019.0EP20K200E 208PQFP 4.025.023.020.017.0240PQFP 3.022.019.018.016.0356BGA
2.012.011.010.09.0484FineLine BGA 5.02
3.022.021.020.0652BGA
1.01
2.011.010.09.0672
FineLine BGA 5.021.020.019.018.0EP20K200C 208PQFP 4.025.023.020.017.0240PQFP 3.022.019.018.016.0356BGA 2.012.011.010.09.0484
FBGA
5.0
23.0
22.0
21.0
20.0
Table 23.Thermal Resistance of APEX 20K & APEX 20KE Devices (Part 2 of 3)Device
Pin Count
Package
θJC (° C/W)θJA (° C/W)Still Air θJA (° C/W)100 ft./min.θJA (° C/W)200 ft./min.θJA (° C/W)
400 ft./min.
Altera Device Package Information Data Sheet
Notes to Table 23:(1)
fin is an extra heat sink that customer’s can add to the device. Several vendors make heat sinks, and they all have different sizes. Altera performed the thermal calculations in Table 23 using the following fin specifications: width: 0.25 mm; height: 7.0 mm; pitch: 1.5 mm; base thickness: 0.5 mm.
EP20K300E
240PQFP 3.019.018.016.015.0652BGA
1.01
2.011.010.09.0672
FineLine BGA 5.020.019.018.017.0EP20K400652BGA 0.59.08.07.0 6.0655PGA
1.08.07.0 6.0 4.0672FineLine BGA 0.111.69.67.9 6.5672
FineLine BGA w/ fin (1)0.57.0 4.0 3.0 2.6EP20K400E
EP20K400C
652BGA
0.59.08.07.0 6.0672FineLine BGA 0.211.79.78.0 6.7672
FineLine BGA w/ fin (1)0.57.0 4.0 3.0 2.6EP20K600E EP20K600C
652BGA
0.59.08.07.0 6.0672FineLine BGA 0.111.69.67.9 6.5672FineLine BGA w/ fin (1)0.5 5.0 3.0 3.0 2.01,020FineLine BGA 0.110.48.4 6.8 5.61,020
FineLine BGA w/ fin (1)0.5 5.0 3.0 3.0 2.0EP20K1000E EP20K1000C
652FineLine BGA 0.19.37.4 6.0 4.9652FineLine BGA w/ fin (1)0.5 4.0 3.0 3.0 2.0672FineLine BGA 0.111.49.47.7 6.3672FineLine BGA w/ fin (1)
0.5 6.0 4.0 3.0 2.01,020FineLine BGA 0.110.18.2 6.6 5.41,020
FineLine BGA w/ fin
0.5 5.0 3.0 2.0 2.0EP20K1500E 652FineLine BGA 0.19.27.3 5.8 4.8652FineLine BGA w/ fin (1)
0.5 4.0 3.0 2.5 2.01,020FineLine BGA 0.110.18.1 6.4 5.31,020
FineLine BGA w/ fin (1)
0.5
5.0
3.0
2.5
2.0
Table 23.Thermal Resistance of APEX 20K & APEX 20KE Devices (Part 3 of 3)Device
Pin Count
Package
θJC (° C/W)θJA (° C/W)Still Air θJA (° C/W)100 ft./min.θJA (° C/W)200 ft./min.θJA (° C/W)
400 ft./min.
Altera Device Package Information Data Sheet Table 24.Thermal Resistance of ACEX 1K Devices
Device Pin
Count PackageθJC (° C/W)θJA (° C/W)
Still Air
θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400 ft./min.
EP1K10100TQFP11.037.035.033.029.0 144TQFP8.031.029.028.025.0
208PQFP 6.030.029.027.022.0
256FineLine BGA12.037.035.033.030.0 EP1K30144TQFP8.028.027.026.024.0 208PQFP 5.030.028.026.021.0
256FineLine BGA9.031.029.028.025.0 EP1K50144TQFP7.026.025.024.023.0 208PQFP 5.029.028.025.020.0
256FineLine BGA7.030.028.027.024.0
484FineLine BGA 5.025.024.023.022.0 EP1K100208PQFP 5.028.026.023.018.0 256 FineLine BGA 6.028.026.025.023.0
484FineLine BGA 5.024.023.022.021.0 Table 25.Thermal Resistance of FLEX10K Devices(Part 1 of 3)
Device Pin
Count PackageθJC (° C/W)θJA (° C/W)
Still Air
θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400 ft./min.
EPF10K1084PLCC9.028.026.024.022.0 144TQFP7.026.025.024.023.0
208PQFP 5.029.027.025.020.0 EPF10K10A100TQFP10.035.033.031.028.0 144TQFP7.029.028.026.025.0
208PQFP 5.030.029.027.021.0
256FineLine BGA7.033.030.028.026.0 EPF10K20144TQFP 6.024.023.022.021.0 208RQFP 1.017.016.015.013.0
240RQFP 1.014.012.011.010.0 EPF10K30208RQFP 1.017.016.015.012.0 240RQFP 1.013.012.011.010.0
356BGA 1.012.011.010.09.0
Altera Device Package Information Data Sheet
EPF10K30A
144TQFP 7.025.024.023.022.0208PQFP 5.029.027.024.019.0240PQFP 4.025.022.020.017.0256FineLine BGA 6.028.026.024.023.0356BGA
1.01
2.011.010.09.0484
FineLine BGA 5.024.022.021.020.0EPF10K30E 144TQFP 9.028.027.026.024.0208PQFP 5.030.028.026.021.0256FineLine BGA 9.031.029.028.025.0484
FineLine BGA 6.026.025.024.022.0EPF10K40208RQFP 1.017.016.015.012.0240RQFP 1.013.012.011.010.0EPF10K50
240RQFP 1.012.011.010.09.0356BGA 1.012.011.010.09.0403
PGA 3.012.010.09.08.0PGA (1) 3.010.08.07.0 6.0EPF10K50V 240PQFP 1.013.012.011.010.0240RQFP 1.013.012.011.010.0356BGA
1.01
2.011.010.09.0484
FineLine BGA 5.023.022.021.020.0EPF10K50E 144TQFP 9.026.025.024.023.0208PQFP 5.029.027.024.019.0240PQFP 4.025.022.020.017.0256FineLine BGA 6.029.027.026.024.0484
FineLine BGA 5.025.024.023.021.0EPF10K50S 144TQFP 9.026.025.024.023.0208PQFP 5.029.028.025.020.0240PQFP 4.026.023.020.017.0256FineLine BGA 7.030.028.027.024.0356BGA
1.01
2.011.010.09.0484
FineLine BGA 5.025.024.023.022.0EPF10K70240RQFP 1.012.011.010.09.0503PGA 1.08.07.0 6.0 4.0EPF10K100
503
PGA 1.08.07.0 6.0 4.0PGA (1) 1.0 6.0 5.0 4.0 3.0PGA (2)
–
2.0
–
–
–
Table 25.Thermal Resistance of FLEX 10K Devices (Part 2 of 3)Device
Pin Count
Package
θJC (° C/W)θJA (° C/W)Still Air θJA (° C/W)100 ft./min.θJA (° C/W)200 ft./min.θJA (° C/W)
400 ft./min.
Altera Device Package Information Data Sheet
Notes to Table 25:(1)
Attached pin-fin heat sink.
(2)
Attached motor driven fan heat sink.
EPF10K100A
240RQFP 1.013.011.010.09.0356BGA
1.01
2.011.010.09.0484FineLine BGA 5.022.021.020.018.0600
BGA 0.510.09.08.07.0EPF10K100E 208PQFP 5.028.026.023.018.0240PQFP 4.023.021.019.016.0256FineLine BGA 6.028.026.025.023.0356BGA
1.01
2.011.010.09.0484
FineLine BGA 5.024.023.022.021.0EPF10K130V 599PGA 1.08.07.0 6.0 4.0600BGA 0.510.09.08.07.0EPF10K130E
240PQFP 4.021.019.017.015.0356BGA
1.01
2.011.010.09.0484FineLine BGA 5.02
3.022.021.020.0600BGA
0.510.09.08.07.0672
FineLine BGA 5.021.020.019.018.0EPF10K200E 599PGA 1.08.07.0 6.0 4.0600BGA
0.510.09.08.07.0672
FineLine BGA 5.020.019.018.017.0EPF10K200S 240RQFP 1.013.011.010.09.0356BGA
1.01
2.011.010.09.0484FineLine BGA 5.022.021.020.019.0600BGA
0.510.09.08.07.0672
FineLine BGA 5.021.020.019.018.0EPF10K250A 599PGA 1.08.07.0 6.0 4.0600
BGA
0.5
10.0
9.0
8.0
7.0
Table 25.Thermal Resistance of FLEX 10K Devices (Part 3 of 3)Device
Pin Count
Package
θJC (° C/W)θJA (° C/W)Still Air θJA (° C/W)100 ft./min.θJA (° C/W)200 ft./min.θJA (° C/W)
400 ft./min.
Altera Device Package Information Data Sheet Table 26.Thermal Resistance of FLEX8000 Devices
Device Pin Count PackageθJC (° C/W)θJA (° C/W)
Still Air θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400 ft./min.
EPF8282A84PLCC10.030.028.026.023.0 100TQFP11.036.034.032.029.0 EPF8452A84PLCC10.030.028.026.023.0 100TQFP11.035.033.031.028.0
160PQFP 6.032.031.030.028.0
160PGA 6.020.013.010.08.0 EPF8636A84PLCC10.029.028.026.023.0 160PQFP 6.032.031.030.027.0
192PGA 6.016.011.08.0 6.0
208PQFP 5.030.038.026.020.0
208RQFP 1.017.016.015.014.0 EPF8820A144TQFP9.026.025.024.023.0 160PQFP 6.032.031.030.027.0
192PGA 6.016.011.08.0 6.0
208PQFP 5.029.027.025.020.0
208RQFP 1.017.016.015.014.0
225BGA 6.028.019.014.011.0 EPF81188A208PQFP 5.028.026.024.019.0 232PGA 2.014.010.07.0 5.0
240PQFP 4.024.021.019.016.0
240RQFP 1.014.012.011.010.0 EPF81500A240PQFP 4.022.020.019.016.0 240RQFP 1.013.012.011.010.0
280PGA 2.014.010.07.0 5.0
304RQFP 1.011.010.09.08.0
Altera Device Package Information Data Sheet Table 27.Thermal Resistance of FLEX6000 Devices
Device Pin Count PackageθJC (° C/W)θJA (° C/W)
Still Air θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400 ft./min.
EPF6010A100TQFP11.035.033.031.028.0 144TQFP10.028.026.025.024.0 EPF6016144TQFP10.028.026.025.024.0 208PQFP 5.030.028.026.021.0
240PQFP 4.026.024.021.017.0
256BGA 6.028.022.020.019.0 EPF6016A100TQFP11.035.033.031.028.0 FineLine BGA14.036.034.032.029.0 144TQFP10.029.028.026.024.0
208PQFP 5.030.029.026.021.0
256FineLine BGA10.032.030.029.026.0 EPF6024A144TQFP10.027.026.025.024.0 208PQFP 5.029.028.026.020.0
240PQFP 4.026.023.021.017.0
256BGA 6.028.022.020.019.0 FineLine BGA8.030.029.027.025.0
Altera Device Package Information Data Sheet Table 28.Thermal Resistance of MAX9000 Devices
Device Pin Count PackageθJC (° C/W)θJA (° C/W)
Still Air θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400 ft./min.
EPM932084PLCC9.029.027.025.023.0 208RQFP 1.017.016.015.013.0
280PGA 2.014.010.07.0 5.0
356BGA 2.014.012.011.010.0 EPM9320A84PLCC9.029.027.026.023.0 208RQFP 2.017.016.015.013.0
356BGA 1.012.011.010.09.0 EPM940084PLCC9.029.027.025.023.0 208RQFP 1.017.016.015.013.0
240RQFP 1.014.012.011.010.0 EPM9480208RQFP 1.017.016.015.012.0 240RQFP 1.012.011.010.09.0 EPM9560208RQFP 1.017.016.015.012.0 240RQFP 1.012.011.010.09.0
280PGA 2.014.010.07.0 5.0
304RQFP 1.012.011.010.09.0
356BGA 1.012.011.010.09.0 EPM9560A208RQFP 1.017.016.015.012.0 240RQFP 1.011.010.09.08.0
356BGA 1.012.011.010.09.0 Table 29.Thermal Resistance of MAX 7000 Devices(Part 1 of 4)
Device Pin Count PackageθJC (° C/W)θJA (° C/W)
Still Air θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400 ft./min.
EPM703244PLCC10.033.031.030.027.0
PQFP15.048.046.045.042.0
TQFP14.046.044.043.040.0 EPM7032B44PLCC10.033.031.030.027.0
TQFP14.046.044.043.040.0 49Ultra FineLine
BGA
23.069.067.066.062.0 EPM7032S44PLCC10.033.031.030.027.0
TQFP14.046.044.043.040.0 EPM7032V44PLCC9.031.030.028.025.0
TQFP14.045.044.042.039.0
Altera Device Package Information Data Sheet
EPM7032AE 44PLCC 9.031.030.028.025.0TQFP 14.046.045.043.040.0EPM7064S
44PLCC 9.031.030.028.025.0TQFP 14.046.044.043.040.084PLCC 9.028.026.025.023.0100
TQFP 11.039.037.035.032.0EPM706444PLCC 9.031.030.028.025.0TQFP 13.044.043.041.038.068PLCC 9.029.028.026.023.084PLCC 9.028.026.025.022.0100
PQFP 6.033.032.031.030.0EPM7064AE EPM7064B
44PLCC 9.031.030.028.025.0TQFP 14.046.045.043.040.049Ultra FineLine BGA 23.056.053.051.047.0100
TQFP 12.039.037.035.031.0FineLine BGA 21.049.047.044.040.0EPM709668PLCC 9.029.027.026.023.084PLCC 9.028.026.024.022.0100
PQFP 6.032.031.030.029.0EPM7128A 84PLCC 9.028.026.025.022.0100TQFP 11.037.035.033.030.0FineLine BGA 18.044.042.039.035.0144TQFP 9.031.029.028.025.0256
FineLine BGA 12.038.036.034.031.0EPM7128B 49Ultra FineLine BGA 22.053.050.048.044.0100TQFP 11.038.036.034.031.0FineLine BGA 19.046.044.041.037.0144TQFP 9.032.030.029.026.0169Ultra FineLine BGA
16.044.042.039.035.0256
FineLine BGA 13.040.038.036.033.0EPM7128E 84PLCC 10.029.028.026.023.0100PQFP 6.032.031.030.029.0160
PQFP
6.0
32.0
31.0
30.0
28.0
Table 29.Thermal Resistance of MAX 7000 Devices (Part 2 of 4) Device
Pin Count
Package
θJC (° C/W)θJA (° C/W)Still Air θJA (° C/W)100 ft./min.θJA (° C/W)200 ft./min.θJA (° C/W)
400 ft./min.
Altera Device Package Information Data Sheet
EPM7128S
84PLCC 10.030.028.026.023.0100TQFP 12.038.036.034.030.0PQFP 10.035.034.033.032.0160
PQFP 7.033.032.031.030.0EPM7128AE 84PLCC 11.030.028.026.023.0100TQFP 12.038.036.034.030.0FineLine BGA 14.043.040.038.037.0144TQFP 11.033.030.028.026.0169Ultra FineLine BGA
14.042.040.038.036.0256
FineLine BGA 12.039.037.035.031.0EPM7160E 84PLCC 10.029.028.026.023.0100PQFP 6.032.031.030.029.0160
PQFP 6.033.032.031.030.0EPM7160S 84PLCC 10.035.028.026.023.0100TQFP 12.037.035.033.030.0160
PQFP 6.033.032.031.030.0EPM7192S 160PQFP 6.032.031.030.029.0EPM7192E 160PGA 6.020.013.010.08.0PQFP 6.032.031.030.026.0EPM7256A
100TQFP 9.036.034.032.030.0144TQFP 8.032.027.025.024.0208PQFP 5.030.028.026.021.0256
FineLine BGA 12.034.032.029.028.0EPM7256B 100TQFP 12.037.035.033.030.0144TQFP 9.033.029.027.025.0169Ultra FineLine BGA 13.040.038.036.034.0208PQFP 5.031.029.027.022.0256
FineLine BGA 9.034.032.030.028.0EPM7256E 192PGA 6.020.013.010.08.0160PQFP 6.031.030.029.025.0208
RQFP 1.017.016.015.013.0EPM7256S 208
PQFP 5.030.029.026.021.0RQFP
1.0
18.0
17.0
16.0
15.0
Table 29.Thermal Resistance of MAX 7000 Devices (Part 3 of 4) Device
Pin Count
Package
θJC (° C/W)θJA (° C/W)Still Air θJA (° C/W)100 ft./min.θJA (° C/W)200 ft./min.θJA (° C/W)
400 ft./min.