GLT4160L04-70TC中文资料

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

Features :

Description :

? 4,194,304 words by 4 bits organization.? Fast access time and cycle time ? Low power dissipation.

? Read-Modify-Write, RAS -Only Refresh,

CAS -Before-RAS Refresh, Hidden Refresh.

? 2,048 refresh cycles per 32ms.

? Available in 300 mil 26(24) SOJ and TSOPII.? 3.3V ±0.3V Vcc Power Supply voltage .? All inputs and Outputs are LVTTL compatible.? Extended Data-Out (EDO) Page access

cycle.

? Self-refresh Capability . (S-Version).

The GLT4160L04 is a high-performance CMOS dynamic random access memory containing 16,777,216 bits organized in a x4configuration. The GLT4160L04 offers page cycle access with Extended Data Output.The GLT4160L04 has 11 row- and 11column-addresses, and accepts 2048-cycle refresh in 32 ms.

The GLT4160L04 provides EDO PAGE MODE operation which allows for fast data access within a row-address defined boundary, up to 2048 x 4 bits with cycle times as short as 18ns.

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

Pin Configuration :

V cc DQ 0A 0A 1A 2A 31234568910111213

2221191817161514

26252423A 9A 8A 7A 6OE CAS V SS DQ 3DQ 1WE RAS NC V CC

DQ 2A 5A 4V SS

A 10

V cc DQ 0A 10A 0A 1A 2A 31234568910111213

2221191817161514

26252423A 9A 8A 7A 6OE CAS V SS DQ

3DQ 1WE RAS NC V CC

DQ 2A 5A 4V SS

Pin Descriptions:

GLT4160L04300mil 26(24) TSOPII

GLT4160L04300mil 26(24) SOJ

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

Absolute Maximum Ratings*Capacitance*

Operating Temperature, T A (ambient)

.............................................….0°C to

+70°C For Extended Temperature……………..-20°C to 85°C

Storage Temperature(plastic)............-55°C to +150°C

Voltage Relative to V SS ........................-0.5V to + 4.6V Power Dissipation...............................................1.0W

*Note: Operation above Absolute Maximum Ratings can

aversely affect device reliability.

*Note: Capacitance is sampled and not 100% tested

Electrical Specifications

l All voltages are referenced to GND.

l After power up, wait more than 200μs and then, execute eight CAS -before-RAS

or RAS -only

refresh cycles as dummy cycles to initialize internal circuit.

Block Diagram :

A 1A 2A 3A 4A 5A 6A 7A 8A 9A WE CAS

DQ 0DQ 1DQ 2DQ 3

V DD V SS

A 0

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

Truth Table:

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

DC and Operating Characteristics (1-2)

1. I CC is dependent on output loading when the device output is selected. Specified I CC (max.) is measured with the output open.

2. I CC is dependent upon the number of address transitions specified ICC(max.) is measured with a maximum of one transition per address cycle

in random Read/Write and EDO Fast Page Mode.

3. Specified V IL (min.) is steady state operation. During transitions V IL (min.) may undershoot to –1V for a period not to exceed 15ns. All AC

parameters are measured with V IL (min.)≥V SS and V IH (max.)≤V CC .

4. Specified V IH (max.) is steady state operation . During transitions V IH (max.) may overshoot to V CC +1V for a period not to exceed 15ns. All AC

parameters are measured with V IL (min.) ≥ V SS and VIH(max.) ≤ V CC . 5. S-Version.

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

AC Characteristics

T A =0°C to 70°C , -20°C to 85°C V CC = 3.3 V ± 0.3V, VIH/VIL = 3/0 V, V OH /V OL = 2/0.8V

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

AC Characteristics

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1) Array

G-Link Technology G-Link Technology Corporation,Taiwan

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1) Array

G-Link Technology G-Link Technology Corporation,Taiwan

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

Notes:

1. Measure with a load equivalent to one TTL input and 100 pF.

2. Assumes that t RCD ≤ t RCD (max.). If t RCD is greater than t RCD (max.), access time will be t AA dominant.

3. Assumes that t RAD ≤ t RAD (max.). If t RAD is greater than t RCD (max.), access time will be controlled by t CAC .

4. Either t RRH or t RCH must be satisfied for a Read Cycle.

5. Access time is determined by the longest of t AA , t CAC and t CPA .

6. Assumes that t RAD ≥ t RAD (max.).

7. Operation within the t RAD (max.) limit ensures that t RAC (max.) can be met. t RAD (max.) is specified as a reference point only. If t RAD is greater than the specified t RAD (max.) limit, the access time is controlled by t CAA and t CAC .

8. t WCS , t RWD , t AWD and t CWD are not restrictive operating parameters. 9. t WCS (min.) must be satisfied in an Early Write Cycle.

10. t DS and t DH are referenced to the latter occurrence of CAS or WE .

11. t T is measured between V IH (min.) and V IL (max.). AC-measurements assume t T = 2 ns.

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

Read CYCLE

ROW ADDRESS

COLUMN ADDRESS

DATA-OUT

t RC t RAS

t RP

t CRP

t CSH

t RCD

t RSH t CAS

t CRP

t ASR

t RAH

t RAD t ASC

t CAH

t RAL t RCH t RRH

t AR

t RCS

t AA

t OEA

t CEZ

t OEZ

t CAC

t CLZ

t RAC

Don't Care

V IH-

V IL-

V IH-

V IL-

CAS

V IH-V IL-

Address

V IH-V IL-

V OH-V OL-

Early Write Cycle NOTE : D OUT = OPEN

V IH-V IL-

RAS

V V CAS

V V Address

V V WE

V V V IH-V IL-DQ

Don't Care

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

OE Controlled Write Cycle NOTE : D OUT = OPEN

DATA - IN

V V IL-

RAS

V V CAS

V V Address

V IH-V IL-

Don't Care

t RSH

V V IL-

RAS

V V CAS

V V Address

V V WE

V V OE

V V DQ

Don't Care

t RAS

t CLZ

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

EDO Page Mode Read Cycle NOTE : D OUT = OPEN

t OLZ t RAC t CAC t OEZ

DATA-OUT DATA-OUT

V IH-V IL-

RAS

V V CAS

V IH-V IL-

Address

V IH-V IL-

V V OE

V V Don't Care

t RHCP

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

EDO Page Mode Read - Modify - Write Cycle NOTE : D OUT = OPEN

t RP

V IH-V

IL-

RAS

V V

CAS

Don't Care

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

CAS - Before - RAS Refresh Cycle

V IH-V IL-

RAS

V IH-V IL-

CAS

V IH-V IL-

RAS -Only Refresh Cycle

V IH-V IL-

RAS

t RAS

V IH-

V IL-

CAS

t CRP

t ASR

t ASR Address

V IH-V IL-

Hidden Refresh Cycle ( Read )

V IH-V IL-

RAS

V V UCAS,LCAS

V V Address

V V WE

V V OE

V V Don't Care

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

Hidden Refresh Cycle ( Write ) NOTE : D OUT = OPEN

V IH-V IL-

RAS

V V CAS

V V Address

V V WE

V V DQ

V V Don't Care

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

CAS-Before RAS Refresh Counter Test Cycle

V V V IH-V IL-

Don't Care

DATA-IN

DATA-OUT V IH-V IL-Address V V WE V V V V DQ V V WE V V V V DQ V V V V OE V V DQ

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

TEST MODE IN CYCLE

Don't Care

V IH-V IL-V IH-V IL-

V IH-V IL-

V I/OH-V I/OL-RAS

CAS

DQ Test Mode

By using the test mode, the test time can be reduced. The reason for this is that, the memory emulates the x 16-bit organization during test mode. Don’t care about the input levels of the CAS input A0, A1 .(1) Setting the mode

Executing the test mode cycle (WE , CAS before RAS refresh cycle ) sets the test mode.

(2) Write / read operation

When either a “0” or a “1” is written to the input pin in test mode, this data is written to 16 bits of memory cell.Next, when the data is read from the output pin at the same address, the cell be checked.

Output = “1” Normal write (all memory cells)Output = “0” Abnormal write

(3) Refresh

Refresh in the test mode must be performed with the RAS / CAS cycle or with the WE, CAS before RAS refresh cycle. The WE, CAS before RAS refresh cycle use the same counter as the CAS before RAS refresh’s internal counter.(4) Mode Cancellation

The test mode is cancelled by executing one cycle of RAS only refresh cycle or CAS before RAS refresh cycle.

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

CAS-BEFORE-RAS SELF REFRESH CYCLE

Don't Care

V IH-V IL-V IH-V IL-

V I/OH-V I/OL-CAS

V IH-V IL-WE

NOTE : OE , Address = Don’t Care

GLT4160L04

4M X 4 CMOS DYNAMIC RAM WITH EXTENDED DATA OUTPUT

May 2001 (Rev.3.1)

G-Link Technology

G-Link Technology Corporation,Taiwan

Ordering Information

Part Number

SPEED

POWER

FEATURE

TEMPERATURE

PACKAGE

GLT4160L04-40J340ns Normal EDO Commercial SOJ 300mil 26(24)L GLT4160L04-50J350ns Normal EDO Commercial SOJ 300mil 26(24)L GLT4160L04-60J360ns Normal EDO Commercial SOJ 300mil 26(24)L GLT4160L04-70J370ns Normal EDO Commercial SOJ 300mil 26(24)L GLT4160L04E-40J340ns Normal EDO Extended SOJ 300mil 26(24)L GLT4160L04E-50J350ns Normal EDO Extended SOJ 300mil 26(24)L GLT4160L04E-60J360ns Normal EDO Extended SOJ 300mil 26(24)L GLT4160L04E-70J370ns Normal EDO Extended SOJ 300mil 26(24)L GLT4160L04S-40J340ns Self Refresh EDO Commercial SOJ 300mil 26(24)L GLT4160L04S-50J350ns Self Refresh EDO Commercial SOJ 300mil 26(24)L GLT4160L04S-60J360ns Self Refresh EDO Commercial SOJ 300mil 26(24)L GLT4160L04S-70J370ns Self Refresh EDO Commercial SOJ 300mil 26(24)L GLT4160L04SE-40J340ns Self Refresh EDO Extended SOJ 300mil 26(24)L GLT4160L04SE-50J350ns Self Refresh EDO Extended SOJ 300mil 26(24)L GLT4160L04SE-60J360ns Self Refresh EDO Extended SOJ 300mil 26(24)L GLT4160L04SE-70J370ns Self Refresh EDO Extended SOJ 300mil 26(24)L GLT4160L04-40TC 40ns Normal EDO Commercial TSOPII 300mil 26(24)L GLT4160L04-50TC 50ns Normal EDO Commercial TSOPII 300mil 26(24)L GLT4160L04-60TC 60ns Normal EDO Commercial TSOPII 300mil 26(24)L GLT4160L04-70TC 70ns Normal EDO Commercial TSOPII 300mil 26(24)L GLT4160L04E-40TC 40ns Normal EDO Extended TSOPII 300mil 26(24)L GLT4160L04E-50TC 50ns Normal EDO Extended TSOPII 300mil 26(24)L GLT4160L04E-60TC 60ns Normal EDO Extended TSOPII 300mil 26(24)L GLT4160L04E-70TC 70ns Normal EDO Extended TSOPII 300mil 26(24)L GLT4160L04S-40TC 40ns Self Refresh EDO Commercial TSOPII 300mil 26(24)L GLT4160L04S-50TC 50ns Self Refresh EDO Commercial TSOPII 300mil 26(24)L GLT4160L04S-60TC 60ns Self Refresh EDO Commercial TSOPII 300mil 26(24)L GLT4160L04S-70TC 70ns Self Refresh EDO Commercial TSOPII 300mil 26(24)L GLT4160L04SE-40TC 40ns Self Refresh EDO Extended TSOPII 300mil 26(24)L GLT4160L04SE-50TC 50ns Self Refresh EDO Extended TSOPII 300mil 26(24)L GLT4160L04SE-60TC 60ns Self Refresh EDO Extended TSOPII 300mil 26(24)L GLT4160L04SE-70TC

70ns

Self Refresh

EDO

Extended

TSOPII 300mil 26(24)L