Nichtek_WDST06PMS_20130613

Nichtek_WDST06PMS_20130613
Nichtek_WDST06PMS_20130613

ESTABLISHMENT

APPROV ED

REV ISION

2013.06.13 Series NO:WDS T06P121106006

DATE :

You can reapprove only the changed quality request recorded in spec sheet.

And, We can decide other changed parts

APPROVAL SHEET

Surge LAN Transformer

CUSTOMER :

ITEM : Surge LAN Transformer

2012.11.06

Surge LAN Transformer is the hybrid ◆

LAN Transformer with protection against high level transients such as lightning surge.

Maximum surge level is 6◆KV (Waveform 10/700μs).

Product P/N: WDST06PMS

WDST 06 P M S (1) (2) (3) (4) (5)

(1)Product series:

WDST=Surge LAN Transformer Series (2)Surge Level: 06 = 6KV

(3) Power over Ethernet:

P=Power over Ethernet (720mA) (4) Data Rate: M=10/100M

(5) Ports of Protection:

S=Single Port

Designed to meet IEEE802.3at ◆ requirement

Surge Level: IEC ◆-61000-4-5 Differential Mode: 2KV Common Mode: 6KV ◆ ESD Level : IEC-61000-4-2 Contact: +/- 24KV; Air: +/- 30KV

◆PoE Current: 720mA

◆ Conductive Susceptibility :

IEC61000-4-6 ; Standard Level

Ethernet switching hub application ◆

All Ethernet application ◆ Miniport repeater ◆ Outdoor AP router ◆ IP camera ◆

Electrical specification @ 25℃

350uH Min @ 100KHz,0.2V,8mA DC BIAS

OCL 720mA Current Capability--It is suitable for IEEE 802.3at LL 0.5uH Max @100KHz,0.2V Cw/w 20PF TYP @100KHz,0.2V DCR 1.4?Max

Turn Ratio 1CT:1CT(TX)/1CT:1CT(RX)±2% Polarity 1-16,6-11 In-Phase 100kHz : -1.2dB ( Max )

Insertion LOSS 1MHz-125MHz : -0.2-0.002*f^1.4dB ( Max ) 100kHz-30MHz : -16dB ( Min )

Return LOSS (Z OUT = 100ohm±15%) 30MHz-100MHz : -10+20*log(f/80)dB ( Min ) Cross Talk

(Z OUT = 100ohm±15%)

10MHz – 100MHz : -55+22*log(f/10)dB ( Min ) 30MHz -43dB Min(TX/RX)

60MHz -37dB Min(TX/RX)

Differential Mode Rejection

Ration

100MHz -33dB Min(TX/RX) Isolation Hi-Pot 1500Vrms 60Sec

Thermal Condition

Parameter Min.

Max.

Unit

Storage Temp. -40 85 ℃ Operating Temp.

-40 85 ℃

MILLIMETERS INCHES

DIM Center Tolerances Center Tolerances

A 12.80 ±0.254 0.504 ± 0.010

B 9.50 ±0.254 0.374 ± 0.010

C 9.0(max) 0.35(max)

D 8.89 ±0.127 0.350 ± 0.005

E 0.30 ±0.127 0.012 ± 0.005

F 1.27 ±0.127 0.050 ± 0.005

G 0.46 ±0.127 0.018 ± 0.005

H 9.80 ±0.254 0.386 ± 0.010

I 1.10 ±0.254 0.043 ± 0.010

J 1.30 ±0.254 0.051 ± 0.010

Phase 1 - Pre-Heat

During the Pre-Heat phase, the solder paste dries and its more volatile ingredients evaporate. The component body temperature should be brought at a controlled rate from room temperature (approximately 25℃) to 175±25℃. The maximum rate of change of temperature during the Pre-Heat phase should be less than +3℃/s to avoid component damage due to thermal stress.

Phase 2 - Flux Activation

During the Flux Activation phase the flux component of the solder paste has time to micro-each and clean the metallized pads and component leads in preparation for solder reflow. The component body temperature should be maintained at 175±25℃for 60~180s.

Phase 3 - Reflow

During the reflow phase the component lead temperature is brought to above the melting point of the solder alloy in use and held long enough to ensure complete wetting of all surfaces. For the industry norm solder alloy Sn96.5 Ag3.0 Cu0.5 this melting temperature is 219. The component

℃ lead temperature should be maintained above 219℃for 60 to 150s. The maximum rate of change of temperature during the reflow phase should be less than +3℃/s to avoid component damage due to thermal stress. The maximum component body lead temperature promised for SMT devices during the reflow phase is 245℃for less than 10s.

Phase 4 - Cooling

During the cooling phase the molten solder connections are allowed to slowly re-solidify into strong solder fillets. A fast cooling rate reduces the grain size of the inter-metallic compounds and strengthens the solder joints. However, due to the risk of thermal shock and solder joint brittleness, the maximum rate of change

of temperature during the cooling phase should be less than -6/s.

Package Quantity : 380 pcs per reel

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