333E中文资料

M I X E R S - S M T

7

HMC333 / 333E

GaAs MMIC MIXER w/ INTEGRATED

LO AMPLIFIER, 3.0 - 3.8 GHz

v01.0705

General Description

Features

Functional Diagram

The HMC333 & HMC333E are single balanced mixer ICs with integrated LO amplifi ers. This converter IC can operate as an upconverter or downconverter between 3.0 GHz and 3.8 GHz. With the integrated LO amplifi er, the mixer requires an LO drive level of only 0 dBm, and requires only 7 mA from a single positive +3V rail. The mixer has 8.5 dB of conversion loss, an input P1dB of 0 dBm and an input third order intercept point of +10 dBm at 3.5 GHz.

Integrated LO Amplifi er w/ Pdiss: < 25 mW Conversion Loss / Noise Figure: 8.5 dB Low LO Drive Level: 0 dBm Input IP3: +10 dBm

Single Positive Supply: 3V to 5V

Electrical Specifications,

T A

= +25° C

Typical Applications

The HMC333 / HMC333E is ideal for:? Wireless Local Loop

* Unless otherwise noted, all measurements performed as downconverter, IF= 100 MHz.

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Conversion Gain vs.

Temperature @ LO = 0 dBm

Isolation @ LO = 0 dBm

IF Bandwidth @ LO = 0 dBm

Conversion Gain vs. Vdd @ LO = 0 dBm

Return Loss @ LO = 0 dBm

Conversion Gain vs. LO Drive

HMC333 / 333E

GaAs MMIC MIXER w/ INTEGRATED

LO AMPLIFIER, 3.0 - 3.8 GHz

v01.0705

-20-15

-10-5

2.4

2.6 2.83

3.2 3.4 3.6 3.84

4.2 4.4

C O N V E R S I O N G A I N (d B )

FREQUENCY (GHz)-20

-15

-10

-5

0.2

0.4

0.6

0.8

1

R E S P O N S E (d B )

FREQUENCY (GHz)

-20-15

-10-5

2.4

2.6

2.8

3

3.2

3.4

3.6

3.8

4

4.2

4.4

C O N V E R S I O N G A I N (d B )

FREQUENCY (GHz)

-30

-25

-20-15-10-500

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

6

R E T U R N L O S S (d B ) FREQUENCY (GHz)

-20-15

-10

-5

2.4

2.6

2.8

3

3.2

3.4

3.6

3.8

4

4.2

4.4

C O N V E R S I O N G A I N (d B )

FREQUENCY (GHz)

-20-15

-10

-5

2.4

2.6 2.83

3.2 3.4 3.6

3.8

4

4.2

4.4

I S O L A T I O N (d B )

FREQUENCY (GHz)

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Upconverter Performance

Conversion Gain @ LO = 0 dBm

Input P1dB vs. Vdd @ LO = 0 dBm

Input IP3 vs. Vdd @ LO = 0 dBm*

Input IP3 vs. LO Drive*

Input P1dB vs.

Temperature @ LO = 0 dBm

Input IP3 vs.

Temperature @ LO = 0 dBm*

* Two-tone input power= -10 dBm each tone, 1 MHz spacing.

HMC333 / 333E

GaAs MMIC MIXER w/ INTEGRATED

LO AMPLIFIER, 3.0 - 3.8 GHz

v01.0705

-20

-15

-10

-5

3

3.2

3.4

3.6

3.8

4

C O N V E R S I O N G A I N (d B )

FREQUENCY (GHz)

-10-8

-6-4-202468

102.9

3 3.1 3.2 3.3 3.4

3.5 3.6 3.7 3.8 3.9

I N P U T P 1d B (d B m )

FREQUENCY (GHz)

05

10

15

20

3

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4

I N P U T I P 3 (d B m )

FREQUENCY (GHz)

05

10

15

20

3

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4

I N P U T I P 3 (d B m )

FREQUENCY (GHz)

05

101520

3

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4

I N P U T I P 3 (d B m )

FREQUENCY (GHz)

-10-8

-6-4-202468

102.9

3 3.1 3.2 3.3 3.

4 3.

5 3.6

3.7 3.8 3.9

I N P U T P 1d B (d B m )

FREQUENCY (GHz)

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Harmonics of LO

MxN Spurious @ IF Port

HMC333 / 333E

GaAs MMIC MIXER w/ INTEGRATED

LO AMPLIFIER, 3.0 - 3.8 GHz

v01.0705

M I X E R S - S M T

7

HMC333 / 333E

GaAs MMIC MIXER w/ INTEGRATED

LO AMPLIFIER, 3.0 - 3.8 GHz

v01.0705

Absolute Maximum Ratings

Outline Drawing

ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS

[1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX

Package Information

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.

5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.

M I X E R S - S M T

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HMC333 / 333E

GaAs MMIC MIXER w/ INTEGRATED

LO AMPLIFIER, 3.0 - 3.8 GHz

v01.0705

Pin Descriptions

M I X E R S - S M T

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Application Circuit

HMC333 / 333E

GaAs MMIC MIXER w/ INTEGRATED

LO AMPLIFIER, 3.0 - 3.8 GHz

v01.0705

M I X E R S - S M T

7

Evaluation PCB

The circuit board used in the fi nal application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads should be connected directly to the ground plane similar to that shown. A suffi cient number of VIA holes should be used to connect the top and bottom ground planes. The evaluation circuit board

shown is available from Hittite upon request.

[1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350

List of Materials for Evaluation PCB 105128 [1]

HMC333 / 333E

GaAs MMIC MIXER w/ INTEGRATED

LO AMPLIFIER, 3.0 - 3.8 GHz

v01.0705

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