PCB专业术语翻译 英语
PCB专业用语-中英文对照
PCB专业用语一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfacescopper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
PCB专业术语中英文翻译【VIP专享】
PCB专业术语中英文翻译很多PCB的书上使用的是英文，但是大多数的人又看不懂英文，这时候怎么办呢，我们需要翻译，但是如果每看到一个不会的词儿就去翻译，那么就太耗费时间了，所以我们捷多邦总结了一些常用的专业术语的中英文对照，希望能对大家有用。
1.印制电路：printed circuit2.印制线路：printed wiring3.印制板：printed board4.印制板电路：printed circuit board (pcb)5.印制线路板：printed wiring board(pwb)6.印制元件：printed component7.印制接点：printed contact8.印制板装配：printed board assembly9.板：board 110.表面层合电路板：surface laminar circuit (slc)11.埋入凸块连印制板：b2it printed board12.多层膜基板：multi-layered film substrate(mfs)13.层间全内导通多层印制板：alivh multilayer printed board14.载芯片板：chip on board (cob)15.埋电阻板：buried resistance board16.母板：mother board17.单面印制板：single-sided printed board(ssb)18.双面印制板：double-sided printed board(dsb)19.多层印制板：mulitlayer printed board(mlb)20.多层印制电路板：mulitlayer printed circuit board21.多层印制线路板：mulitlayer prited wiring board22.刚性印制板：rigid printed board23.刚性单面印制板：rigid single-sided printed borad24.刚性双面印制板：rigid double-sided printed borad25.刚性多层印制板：rigid multilayer printed board26.子板：daughter board27.背板：backplane28.裸板：bare board29.键盘板夹心板：copper-invar-copper board30.动态挠性板：dynamic flex board31.静态挠性板：static flex board32.可断拼板：break-away planel33.电缆：cable34.挠性扁平电缆：flexible flat cable (ffc)35.薄膜开关：membrane switch36.混合电路：hybrid circuit37.厚膜：thick film38.厚膜电路：thick film circuit39.薄膜：thin film40.挠性多层印制板：flexible multilayer printed board41.挠性印制板：flexible printed board42.挠性单面印制板：flexible single-sided printed board43.挠性双面印制板：flexible double-sided printed board44.挠性印制电路：flexible printed circuit (fpc)45.挠性印制线路：flexible printed wiring46.刚性印制板：flex-rigid printed board, rigid-flex printed board47.刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed48.刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board49.齐平印制板：flush printed board50.金属芯印制板：metal core printed board51.金属基印制板：metal base printed board52.多重布线印制板：mulit-wiring printed board53.陶瓷印制板：ceramic substrate printed board54.导电胶印制板：electroconductive paste printed board55.模塑电路板：molded circuit board56.模压印制板：stamped printed wiring board57.顺序层压多层印制板：sequentially-laminated mulitlayer58.散线印制板：discrete wiring board59.微线印制板：micro wire board60.积层印制板：buile-up printed board61.积层多层印制板：build-up mulitlayer printed board (bum)62.积层挠印制板：build-up flexible pr上面是一些比较常见的专业用语，有一些不是特别常用的有时候我们也会遇到，所以我们捷多邦也总结了一些不怎么常用的中英文对照，希望对你来说是有用的：1.Absorption 吸收、吸入2.Accelerated Test（Aging）加速试验、加速老化3.Accelerator 加速剂、速化剂4.Accept/Acceptance 允收5.Acceptable Quality Level（AQL）允收品质水准6.Accuracy 准确度ACF：7.Adhesive copper foil 有胶铜箔8.Activator 活化剂、添加剂比称为9.Activator Active parts（Devices）主动零件，指积体电路或电晶体10.Addition Agent 添加剂11.Additive Process 加成法、分全加成、半加成及部份加成12.Back Light（Back Lighting）背光法13.Back-UP 垫板14.Backpanels/ Backplanes 背板、支持板，厚度较厚，15.Ball Grid Array（BGA）球脚车列（封装）16.Barrel 孔壁17.Base Material 基材18.Batch 批（同时间发料某一数量的板子）19.Bevelling 切斜边20.Binder 黏结剂21.Capacitance 电容22.Carbide 碳化物、碳化钨钻头23.CAR: Corrective Action Report 改善报告24.Carbon Treatment 活性碳处理25.Card 卡板26.Carrier 载体27.Cartridge 滤芯28.Cathode 阴极L: Copper Clad Laminates 铜箔基板30.Ceramics 陶瓷31.Certificate 证明书32.CFC 氟氯碳化物33.Chloro-Fluoro-Carbon Chamfer 倒角、去掉直角34.Characteristic Impedance 特性阻抗35.Cheek list 检察清单36.Chip 晶粒、晶片37.Chip On Board 晶片黏著板38.Clean Room 无尘室(Class 100)39.Cleanliness 清洁度40.Clearance 余隙、余环41.COB（Chip on Board）晶片在板上直接组装42.COC（Certificate of Compliance）出货合格书。
pcb专业术语英文及翻译
pcb专业术语英文及翻译摘要：本文介绍了PCB（Printed Circuit Board，印刷电路板）专业术语的英文表达和翻译，根据内容实际需求分为三大类：PCB制造术语、PCB组装术语和PCB测试术语。
在每个类别下，将列举相关术语及其英文表达和翻译，从而帮助读者更好地理解和运用PCB专业术语。
正文：I. PCB制造术语1. 单、双面板 (Single-sided, Double-sided board)单面板：一种仅在板的一侧进行布线和元件安装的印刷电路板。
双面板：一种在两侧布线和元件安装的印刷电路板。
2. 环氧树脂 (Epoxy Resin)环氧树脂是一种常用的PCB基材，具有良好的绝缘性和耐热性。
3. 铜盖膜 (Copper Foil)铜盖膜是覆盖在印刷电路板表面的一层铜箔，用于电气连接。
4. 阻焊层 (Solder Mask Layer)阻焊层是一种覆盖在印刷电路板表面的保护层，用于防止元件的误焊。
5. 玻璃纤维布 (Glass Fiber Cloth)玻璃纤维布是PCB制造中一种常用的增强材料，用于提高印刷电路板的强度和耐磨性。
6. 焊盘 (Pad)焊盘是印刷电路板上用于连接元件引脚的焊接区域。
7. 过孔 (Through-hole)过孔是印刷电路板上贯穿两侧的孔洞，用于连接不同电子元器件。
8. 排针 (Pin Header)排针是一种插针式连接器，常用于将PCB与其他设备连接。
9. 焊接 (Soldering)焊接是将电子元件与印刷电路板焊接在一起的一种连接方法。
II. PCB组装术语1. 表面贴装技术 (Surface Mount Technology, SMT)表面贴装技术是一种将电子元件直接焊接在印刷电路板表面的组装方法。
2. 波峰焊接 (Wave Soldering)波峰焊接是一种通过将印刷电路板浸入焊锡浪涌中来实现电子元件的连接。
3. 焊接膏 (Solder Paste)焊接膏是表面贴装技术中使用的一种黏性材料，用于在印刷电路板上确定元件的位置并进行焊接。
中英文对照的PCB专业用语
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlay er printed board(mlb)13、多层印制电路板：mulitlay er printed circuit board14、多层印制线路板：mulitlay er prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilay er printed board19、挠性多层印制板：flexible multilay er printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilay er printed board, rigid-flex multilay er printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlay er37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlay er printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-lay ered film substrate(mfs)45、层间全内导通多层印制板：alivh multilay er printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：cataly zed board ,coated cataly zed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncataly zed laminate23、粘结层：bonding lay er24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover lay er (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ploy ester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：poly imide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：poly ester resin7、聚酰亚胺树脂：poly imide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acry lic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：sy nthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicy andiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated poly ester36、聚酯薄膜：poly ester37、聚酰亚胺薄膜：poly imide film (pi)38、聚四氟乙烯：polytetrafluoety lene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethy lene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft y arn52、经纱：warp y arn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish ey e68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of y arn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：poly armide fiber79、聚酯纤维非织布：non-woven poly ester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic poly amide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire lay out4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：lay out19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：lay out effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：phy sical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated lay er78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor lay er5、导线宽度/间距：conductor line/space6、第一导线层：conductor lay er no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any lay er inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
[实用参考]PCB专业术语翻译(英语)
![[实用参考]PCB专业术语翻译(英语)](https://img.taocdn.com/s3/m/b0fdf50e5727a5e9856a61e6.png)
PCB专业术语（英语）PCBprintedcircuitboard印刷电路板，指空的线路板PCBAprintedcircuitboardassemblP印刷电路板组件，指完成元件焊接的线路板组件PW APrintedWireAssemblP，AperturelistEditor：光圈表编辑器。
Aperturelistwindows：光圈表窗口。
Annularring：焊环。
ArraP：拼版或陈列。
Acidtrip：蚀刻死角。
AssembP：安装。
BareBGnel：光板，未进行插件工序的PCB板。
BadBadsize：工作台，工作台有效尺寸。
BlindBuriedvia：盲孔，埋孔。
Chamfer：倒角。
Circuit：线路。
CircuitlaPer：线路层。
Clamshelltester：双面测试机。
CoordinatesArea：坐标区域。
CopP-protectkeP：软件狗。
Coutour：轮廓。
Draw：一种圆形的光圈，但只是用于创建线路，不用于创建焊盘。
DrillRack：铅头表。
DrillRackEditor：铅头表编辑器。
DrillRackwindow：铅头表窗口。
DCode：Gerber格式中用不着于表达光圈的代码。
Double-sidedBiard：双面板。
EndofBlockcharacter（EOB）：块结束符。
EGtractNetlist：提取网络。
Firdacial：对位标记。
Flash：焊盘，来源于早期矢量光绘机，在矢量光绘机中，焊盘是光通过光圈“闪出”（Flash）而形成的。
GerberData：从PCBCAD系统到PCB生产过程中最常用的数据格式。
Grid：栅格。
GraphicalEditor：图形编辑器。
IncrementalData：增量数据。
Land：接地层。
LaPerlistwindow：层列表窗口。
LaPersetupArea：层设置窗口。
MultilaPerBoard：多层板。
PCB专业用语 中英文对照
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board(pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit(fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board,rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board(bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit(slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board(cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable(ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate(ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer(cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core,glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent(wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film(pi)38、聚四氟乙烯：polytetrafluoetylene(ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film(fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise,filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil(ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil(ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil(rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation.(eda)12、工程设计自动化：engineering design automaton.(eda2)13、组装设计自动化：assembly aided architectural design.(aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display.(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format.(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization(design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router(cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing(pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction(track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole(pth)31、余隙孔：access hole32、盲孔：blind via(hole)33、埋孔：buried via hole34、埋/盲孔：buried/blind via35、任意层内部导通孔：any layer inner via hole(alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance整理自快点PCB学院。
【名师精品】PCB专业术语翻译(英语).doc
PCB专业术语（英语）PCBpYintedciYcuitboaYd印刷电路板，指空的线路板PCBApYintedciYcuitboaYdassembly印刷电路板组件，指完成元件焊接的线路板组件PWAPYintedWiYeAssembly，ApeYtuYelistEditoY：光圈表编辑器。
ApeYtuYelistwindows：光圈表窗口。
AnnulaYYing：焊环。
AYYay：拼版或陈列。
AcidtYip：蚀刻死角。
Assemby：安装。
BaYeBGnel：光板，未进行插件工序的PCB板。
BadBadsize：工作台，工作台有效尺寸。
BlindBuYiedvia：盲孔，埋孔。
ChamfeY：倒角。
CiYcuit：线路。
CiYcuitlayeY：线路层。
ClamshelltesteY：双面测试机。
CooYdinatesAYea：坐标区域。
Copy-pYotectkey：软件狗。
CoutouY：轮廓。
DYaw：一种圆形的光圈，但只是用于创建线路，不用于创建焊盘。
DYillYack：铅头表。
DYillYackEditoY：铅头表编辑器。
DYillYackwindow：铅头表窗口。
DCode：GeYbeY格式中用不着于表达光圈的代码。
Double-sidedBiaYd：双面板。
EndofBlockchaYacteY（EOB）：块结束符。
EGtYactNetlist：提取网络。
FiYdacial：对位标记。
Flash：焊盘，来源于早期矢量光绘机，在矢量光绘机中，焊盘是光通过光圈“闪出”（Flash）而形成的。
GeYbeYData：从PCBCAD系统到PCB生产过程中最常用的数据格式。
GYid：栅格。
GYaphicalEditoY：图形编辑器。
IncYementalData：增量数据。
Land：接地层。
LayeYlistwindow：层列表窗口。
LayeYsetupAYea：层设置窗口。
MultilayeYBoaYd：多层板。
PCB工程部专业英语词汇(参考模板)
PCB 工程部专业英文词汇词汇1.板料: material2.最低限度: minimum 或者min.3.最大限度: maximum 或者max.4.基准点(零点) datum point5.周期Date code6.V-cut余厚V-cut remain thickness7.抢电铜皮（假铜）dummy copper8.实物板actual board9.外形及尺寸错误dimension error10.异常情形error data file11.焊锡面与零件面对位偏差misregistration12.孔塞plug hole13.要求requirement14.缺少miss15.偏公差uneven tolerance16.补偿compensation17.表面处理surface treatment18.无铅喷锡Lead free HAL19.金手指斜边bevel of G/F20.制程能力process capability21.建议,暗示suggest22.确保ensure23.满足,达到meet24.为了in order to25.交货期delivery date26.绿油桥solder mask bridge 或者solder mask dam27.根据according to 28.单边3mil per side 3 mil29.直径diameter30.半径radius31.小于3mil less than 3mil32.高于3mil more than 3 mil33.压合结构stacking structure 或者stack_up34.附件：attached file35.样品：sample36.文档：Document37.答复：answer; reply38.规格：spec39.与...同样的：the same as40.前版本：previous version(old version)41.生产：production42.确认：confirm43.再次确认：confirm again44.工程问题：engineering query（EQ）45.尽快：as soon as possible46.生产文件：production Gerber47.联系某人：contact somebody48.提交样板：submit sample49.交货期：delivery date50.电测成本：ET（electrical test）cost51.通断测试：Open and short testing52.参考：refer to53.IPC标准：IPC standard54.IPC二级：IPC class 255.可接受的：acceptable56.允许：permit57.制造：manufacture 或者fabricate58.修改：revision59.公差：tolerance60.忽略：ignore61.工具孔：tooling hole62.安装孔：mounting hole63.元件孔：component hole64.槽孔：slot hole65.邮票孔：snap off hole 或者stamp hole66.导通孔：via hole67.盲孔：blind via hole68.埋孔：buried via hole69.金属化孔：PTH(plated through hole)70.非金属化孔：NPTH( no plated through hole)71.孔位：hole location72.避免：avoid73.原设计：original design74.修改：modify75.按原设计：follow up original design76.附边：waste tab, waste area 或者breakaway tab77.铜条：copper strip78.拼板：panel drawing79.板厚：board thickness80.删除：remove(delete)81.削铜：shave the copper82.露铜：copper exposure 或者exposed copper83.光标点: fiducial mark84.不同：be different from(differ from)85.内弧：inside radius86.焊环：annular ring87.单板尺寸：single size 88.拼板尺寸：panel size89.铣,锣：routing90.铣刀：router 或者Routing bit91.楔形掏槽V-cut 或者V scoring92.哑光：matt93.光亮的：glossy94.锡珠：solder ball(solder plugs)95.阻焊：solder mask(solder resist)96.阻焊开窗：solder mask opening97.单面开窗：single side mask opening98.补油：touch up solder mask99.补线：track welds100.毛刺：burrs101.去毛刺：deburr102.镀层厚度：plating thickness103.清洁度：cleanliness104.离子污染：ionic contamination105.阻燃性等级：flammability retardant rating 106.黑化：black oxidation107.棕化：brown oxidation108.红化：red oxidation109.可焊性不良：poor solderability110.焊料：solder111.包装：packaging112.角标：corner mark113.特性阻抗：characteristic impedance 114.正像：positive115.负片：negative116.镜像：mirror117.线宽：line width 或者trace width118.线距：line spacing 或者trace spacing119.做样：build sample120.按照：according to121.成品：finished122.做变更：make the change123.相类似：similar to124.规格：specification125.下移：shift down126.垂直地：vertically127.水平的：horizontally128.增大：increase129.缩小：decrease130.表面处理：Surface Finishing131.波峰焊：wave solder132.钻孔数据：drilling data133.标记：Logo134.Ul 标记：UL logo,或者Ul Marking135.蚀刻标记：etched marking136.周期：date code137.翘曲：bow and twist138.外层：outer layer 或者external layer139.内层：inner layer 或者internal layer140.顶层：top layer141.底层：bottom layer142.元件面：component side143.焊接面：solder side144.阻焊层：solder mask layer145.字符层：legend layer (silkscreen layer or over layer) 146.兰胶层：peelable SM layer147.贴片层：paste mask layer 148.碳油层：carbon layer149.外形层：outline layer(profile layer)150.白油：white ink151.绿油：green ink152.喷锡：hot air leveling (HAL)153.电金,水金：flash gold154.插头镀金：plated gold edge-board contacts 155.金手指：Gold-finger156.防氧化：Entek (OSP)157.沉金：Immersion gold (chem. Gold)158.沉锡：Immersion Tin(chem.Tin)159.沉银：Immersion Silver (chem. silver) 160.单面板：single sided board161.双面板：double sided board162.多层板：multilayer board163.刚性板：rigid board164.挠性板：flexible board165.刚挠板：flex-rigid board166.铣：CNC (mill , routing)167.冲：punching168.倒角：beveling169.斜面：chamfer170.倒圆角：fillet171.尺寸：dimension172.材料：material173.介电常数：Dielectric constant174.菲林：film175.成像：Imaging176.板镀：Panel Plating177.图镀：Pattern Plating178.后清洗：Final Cleaning179.叠层：stacking structure (stack-up) 180.污染焊盘：contaminate pad181.分孔图：drill chart 或者drill map 182.度数：degree183.被…覆盖：be covered with184.负公差：minus tolerance185.标靶盘：target pad186.外形公差：routing tolerance 187.芯板：core188.半固化片Prepreg189.阻抗线：impedance trace190.评估estimate191.玻纤显露Fiber Exposure192.底铜base copper193.工作搞working Gerber194.原稿original art work195.放宽relax196.挖空blanking 或者cut-out 197.一般性阻焊油墨general resist ink 198.孔位错误mis hole location 199.压合周期press cycle200.毛边serrated edges201.跳印skip printing202.气泡blistering203.隔离焊盘isolated pad204.泪滴tear drops205.箭头arrows206.加大Enlarge207.压合周期press cycle 208.毛边serrated edges209.跳印,漏印skip printing210.宽度与厚度的比值width-to-thickness ratio 211.调整adjust212.铜箔基板copper claded laminates213.线路露铜copper exposure214.孔内异物dirty hole215.椭圆形elliptical set216.纤维突出fiber protrusion217.填充料filler218.互相连通interconnection219.改善方案implementation220.板料使用率material use factor221.回路,网络network222.缺口nick223.氧化oxidation224.剥离(剥落) peeling off225.补线不良poor touch-up226.品质等级quality classification227.对位孔registration228.拒收rejectable229.树脂含量resin content230.排列电阻resistor network231.锣刀（铣刀）routing bit232.孔内沾文字S/L on hole233.孔内绿漆S/M on hole234.线路沾锡solder on trace235.金手指沾锡solder on G/F236.废框scrap237.封孔处理sealing238.间距不足spacing non-enough239.靶位孔target hole240.测试线路test circuit241.热应力试验thermal stress242.厚度分布thickness distribution243.薄基板,内层板thin core244.线路缺口及针孔track nick & pin hole245.裁切线trim line246.真平整true leveling247.真正位置的孔true position248.万用型universal249.气化室vaporizer250.仓库warehouse251.契尖角wedge angle252.线细width reduce253.良率yield254.渗铜,渗入,灯芯效应wicking255.允收acceptable256.试样点coupon location257.经核准的，被认可的approved258.超越胜过,超过其他exceed259.牛皮纸kraft paper260.孔壁破铜Hole void261.孔位破出Hole breakoutPCB生产—经典流程—英文培训教程A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size) B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination) c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test)m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation) N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching) N-7 除胶渣(Desmear)N-8 微蚀(Microetching )---精心整理，希望对您有所帮助。
PCB专业英语和层定义
PCB专业英语(PCB SPECIAL ENGLISH)1.PCB=Printed Circuit Board 电路板2.CAM=Computer aided manufacture 计算机辅助3.Pad 焊盘4.Annular ring 焊环5.AOI=automatic optical inspection 自动光学检测6.Charge of free 免费7.WIP=work in process 在线板8.DCC=document control center 文控中心9.Legend 字符10.CS=Component Side =Top Side （顶层）元件面11.SS=Solder Side =Bottom Side （底层）焊锡面12.Gold Plated 电金，镀金13.Nickel Plated 电镍，镀镍14.Immersion Gold 沉金=沉镍金15.Carbon Ink Print 印碳油16.Microsection Report 切片报告，横切面报告17.X-out=Cross-out 打“X”报告18.Panel （客户称）拼板，（生产线称）工作板19.Marking 标记，UL 标记20.Date code 生产周期21.Unit 单元，单位22.Profile 外形，轮廓<outline>23.Profile By Routing 锣(铣)外形24.Wet Film 湿菲林,湿绿油,湿膜25.Slot 槽,方坑26.Base Material=Base Laminate 基材,板料27.V-out =V-score V形槽28.Finished 成品29.Marketing 市场部30.Gerber File GERBER文件31.UL LOGO UL标记32.E-Test=Electric Open/Short Test 电子测试33.PO=Purchase Order 订单34.Tolerance 公差35.Rigid,Flexible Board 刚性,软性板36.Board cut 开料37.Board baking 焗板38.Drill 钻孔39.PTH=Plated Through Hole 镀通孔,沉铜40.Panel plating 板面电镀,全板电镀41.Photo Image 图象,线路图形42.Pattern plating 线路电镀43.Etching 蚀板,蚀刻44.SM=Solder Mask 防焊,阻焊,绿油45.SR=Solder Resist 防焊,阻焊,绿油46.Gold finger 金手指47.Silkscreen 丝印字符48.HAL=HASL=Hot air(Solder)leveling 热风整平喷锡49.Routing 锣板,铣板50.Punching 冲板,啤板51.FOC=final quality checking 终检,最后检查52.FOA=final quality audit 最后稽查(抽查)53.Shippment 出货54.Flux 松香55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金56.Lead free 无铅57.COC=compliance of certificate 材料证明书58.Microsection=cross section 微切片,横切片59.Chamical gold 沉镍金60.Mould=punch die 模具,啤模61.MI=manufacture instruction 制作批示62.QA=quality assurance 品质保证63.CAD=computer aided design 计算机辅助设计64.Drill bit size钻咀直径<diameter>65.Bow and twist 板弯和板曲66.Hit 击打,孔数67.Bonding 邦定,点焊68.Test coupon 测试模块(科邦)69.Thieving copper 抢电流铜皮70.Rail-web71.Break-up tab 工艺边72.Break away tab 工艺边73.GND=ground 地线,大铜皮74.Hole edge 孔边,孔内75.Stamp hole 邮票孔76.Template 天坯,型板,钻孔样板(首板)77.Dry film 干菲林,干膜78.LPI=liquid photo image 液态感光=湿绿油79.Multilayer 多层板80.SMD=surface mouted device 贴片,表面贴装器件81.SMT=surface mouted technology 表面贴装技术82.Peelable mask=blue gel 蓝胶83.Tooling hole 工艺孔,管位,定位孔,工具孔84.Fiducial mask 测光点,光学对位点,对光点,电眼85.Copper foil 铜箔86.Dimension 尺寸87.Nagative负的,positive正的88.Flash gold 闪镀金,镀薄金89.Engineering department 工程部90.Delivery date 交货期91.Bevelling 斜边92.Spacing=gap 间隙,气隙,线隙PCB的各层定义及描述为了方便与印制板厂家的技术沟通，提高对PCB的技术认知一致度，特在此将我司常用PCB的有关板层特性做简单说明，请爱好者参考此说明进行设计和制造。
PCB专业用语-英汉对照
PCB专业用语-英汉对照：一、综合词汇:1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board 10、单面印制板：single-sided printed board(ssb) 11、双面印制板：double-sided printed board(dsb) 12、多层印制板：mulitlayer printed board(mlb) 13、多层印制电路板：mulitlayer printed circuit board 14、多层印制线路板：mulitlayer prited wiring board 15、刚性印制板：rigid printed board 16、刚性单面印制板：rigid single-sided printed borad 17、刚性双面印制板：rigid double-sided printed borad 18、刚性多层印制板：rigid multilayer printed board 19、挠性多层印制板：flexible multilayer printed board 20、挠性印制板：flexible printed board 21、挠性单面印制板：flexible single-sided printed board 22、挠性双面印制板：flexible double-sided printed board 23、挠性印制电路：flexible printed circuit (fpc) 24、挠性印制线路：flexible printed wiring 25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed 27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board 28、齐平印制板：flush printed board 29、金属芯印制板：metal core printed board 30、金属基印制板：metal base printed board 31、多重布线印制板：mulit-wiring printed board 32、陶瓷印制板：ceramic substrate printed board 33、导电胶印制板：electroconductive paste printed board 34、模塑电路板：molded circuit board 35、模压印制板：stamped printed wiring board 36、顺序层压多层印制板：sequentially-laminated mulitlayer 37、散线印制板：discrete wiring board 38、微线印制板：micro wire board 39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board 42、表面层合电路板：surface laminar circuit (slc) 43、埋入凸块连印制板：b2it printed board 44、多层膜基板：multi-layered film substrate(mfs) 45、层间全内导通多层印制板：alivh multilayer printed board 46、载芯片板：chip on board (cob) 47、埋电阻板：buried resistance board 48、母板：mother board 49、子板：daughter board 50、背板：backplane 51、裸板：bare board 52、键盘板夹心板：copper-invar-copper board 53、动态挠性板：dynamic flex board 54、静态挠性板：static flex board 55、可断拼板：break-away planel 56、电缆：cable 57、挠性扁平电缆：flexible flat cable (ffc) 58、薄膜开关：membrane switch 59、混合电路：hybrid circuit 60、厚膜：thick film 61、厚膜电路：thick film circuit 62、薄膜：thin film 63、薄膜混合电路：thin film hybrid circuit 64、互连：interconnection 65、导线：conductor trace line 66、齐平导线：flush conductor 67、传输线：transmission line 68、跨交：crossover 69、板边插头：edge-board contact 70、增强板：stiffener 71、基底：substrate 72、基板面：real estate 73、导线面：conductor side 74、元件面：component side 75、焊接面：solder side 76、印制：printing 77、网格：grid 78、图形：pattern 79、导电图形：conductive pattern 80、非导电图形：non-conductive pattern 81、字符：legend 82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-cladlaminate 7、复合层压板：composite laminate 8、薄层压板：thin laminate 9、金属芯覆铜箔层压板：metal core copper-clad laminate 10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material 13、预浸材料：prepreg 14、粘结片：bonding sheet 15、预浸粘结片：preimpregnated bonding sheer 16、环氧玻璃基板：epoxy glass substrate 17、加成法用层压板：laminate for additive process 18、预制内层覆箔板：mass lamination panel 19、内层芯板：core material 20、催化板材：catalyzed board ,coated catalyzed laminate 21、涂胶催化层压板：adhesive-coated catalyzed laminate 22、涂胶无催层压板：adhesive-coated uncatalyzed laminate 23、粘结层：bonding layer 24、粘结膜：film adhesive 25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film 26、无支撑胶粘剂膜：unsupported adhesive film 27、覆盖层：cover layer (cover lay) 28、增强板材：stiffener material 29、铜箔面：copper-clad surface 30、去铜箔面：foil removal surface 31、层压板面：unclad laminate surface 32、基膜面：base film surface 33、胶粘剂面：adhesive faec 34、原始光洁面：plate finish 35、粗面：matt finish 36、纵向：length wise direction 37、模向：cross wise direction 38、剪切板：cut to size panel 39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl) 40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl) 41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates 42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates 44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates 45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates 46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates 48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates 49、超薄型层压板：ultra thin laminate 50、陶瓷基覆铜箔板：ceramics base copper-clad laminates 51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料:1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin 4、环氧树脂：epoxy resin 5、酚醛树脂：phenolic resin 6、聚酯树脂：polyester resin 7、聚酰亚胺树脂：polyimide resin 8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin 9、丙烯酸树脂：acrylic resin 10、三聚氰胺甲醛树脂：melamine formaldehyde resin 11、多官能环氧树脂：polyfunctional epoxy resin 12、溴化环氧树脂：brominated epoxy resin 13、环氧酚醛：epoxy novolac 14、氟树脂：fluroresin 15、硅树脂：silicone resin 16、硅烷：silane 17、聚合物：polymer 18、无定形聚合物：amorphous polymer 19、结晶现象：crystalline polamer 20、双晶现象：dimorphism 21、共聚物：copolymer 22、合成树脂：synthetic 23、热固性树脂：thermosetting resin 24、热塑性树脂：thermoplastic resin 25、感光性树脂：photosensitive resin 26、环氧当量：weight per epoxy equivalent (wpe) 27、环氧值：epoxy value 28、双氰胺：dicyandiamide 29、粘结剂：binder 30、胶粘剂：adesive 31、固化剂：curing agent 32、阻燃剂：flame retardant 33、遮光剂：opaquer 34、增塑剂：plasticizers 35、不饱和聚酯：unsatuiated polyester 36、聚酯薄膜：polyester 37、聚酰亚胺薄膜：polyimide film (pi) 38、聚四氟乙烯：polytetrafluoetylene (ptfe) 39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep) 40、增强材料：reinforcing material 41、玻璃纤维：glass fiber 42、 e玻璃纤维：e-glass fibre 43、 d玻璃纤维：d-glass fibre 44、 s玻璃纤维：s-glass fibre 45、玻璃布：glass fabric 46、非织布：non-woven fabric 47、玻璃纤维垫：glass mats 48、纱线：yarn 49、单丝：filament 50、绞股：strand 51、纬纱：weft yarn 52、经纱：warp yarn 53、但尼尔：denier 54、经向：warp-wise 55、纬向：weft-wise, filling-wise 56、织物经纬密度：thread count 57、织物组织：weave structure 58、平纹组织：plain structure 59、坏布：grey fabric 60、稀松织物：woven scrim 61、弓纬：bow of weave 62、断经：end missing 63、缺纬：mis-picks 64、纬斜：bias 65、折痕：crease 66、云织：waviness 67、鱼眼：fish eye 68、毛圈长：feather length 69、厚薄段：mark 70、裂缝：split 71、捻度：twist of yarn 72、浸润剂含量：size content 73、浸润剂残留量：size residue 74、处理剂含量：finish level 75、浸润剂：size 76、偶联剂：couplint agent 77、处理织物：finished fabric 78、聚酰胺纤维：polyarmide fiber 79、聚酯纤维非织布：non-woven polyester fabric 80、浸渍绝缘纵纸：impregnating insulation paper 81、聚芳酰胺纤维纸：aromatic polyamide paper 82、断裂长：breaking length 83、吸水高度：height of capillary rise 84、湿强度保留率：wet strength retention 85、白度：whitenness 86、陶瓷：ceramics 87、导电箔：conductive foil 88、铜箔：copper foil 89、电解铜箔：electrodeposited copper foil (ed copper foil) 90、压延铜箔：rolled copper foil 91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil 94、涂胶铜箔：adhesive coated foil 95、涂胶脂铜箔：resin coated copper foil (rcc) 96、复合金属箔：composite metallic material 97、载体箔：carrier foil 98、殷瓦：invar 99、箔（剖面）轮廓：foil profile 100、光面：shiny side 101、粗糙面：matte side 102、处理面：treated side 103、防锈处理：stain proofing 104、双面处理铜箔：double treated foil四、设计:1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae) 10、计算机辅助测试：computer-aided test.(cat) 11、电子设计自动化：electric design automation .(eda) 12、工程设计自动化：engineering designautomaton .(eda2) 13、组装设计自动化：assembly aided architectural design. (aaad) 14、计算机辅助制图：computer aided drawing 15、计算机控制显示：computer controlled display .(ccd) 16、布局：placement 17、布线：routing 18、布图设计：layout 19、重布：rerouting 20、模拟：simulation 21、逻辑模拟：logic simulation 22、电路模拟：circit simulation 23、时序模拟：timing simulation 24、模块化：modularization 25、布线完成率：layout effeciency 26、机器描述格式：machine descriptionm format .(mdf) 27、机器描述格式数据库：mdf databse 28、设计数据库：design database 29、设计原点：design origin 30、优化（设计）：optimization (design) 31、供设计优化坐标轴：predominant axis 32、表格原点：table origin 33、镜像：mirroring 34、驱动文件：drive file 35、中间文件：intermediate file 36、制造文件：manufacturing documentation 37、队列支撑数据库：queue support database 38、元件安置：component positioning 39、图形显示：graphics dispaly 40、比例因子：scaling factor 41、扫描填充：scan filling 42、矩形填充：rectangle filling 43、填充域：region filling 44、实体设计：physical design 45、逻辑设计：logic design 46、逻辑电路：logic circuit 47、层次设计：hierarchical design 48、自顶向下设计：top-down design 49、自底向上设计：bottom-up design 50、线网：net 51、数字化：digitzing 52、设计规则检查：design rulechecking 53、走（布）线器：router (cad) 54、网络表：net list 55、计算机辅助电路分析：computer-aided circuit analysis 56、子线网：subnet 57、目标函数：objective function 58、设计后处理：post design processing (pdp) 59、交互式制图设计：interactive drawing design 60、费用矩阵：cost metrix 61、工程图：engineering drawing 62、方块框图：block diagram 63、迷宫：moze 64、元件密度：component density 65、巡回售货员问题：traveling salesman problem 66、自由度：degrees freedom 67、入度：out going degree 68、出度：incoming degree 69、曼哈顿距离：manhatton distance 70、欧几里德距离：euclidean distance 71、网络：network 72、阵列：array 73、段：segment 74、逻辑：logic 75、逻辑设计自动化：logic design automation 76、分线：separated time 77、分层：separated layer 78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.1 7、圆形盘：round pad 8、方形盘：square pad 9、菱形盘：diamond pad 10、长方形焊盘：oblong pad 11、子弹形盘：bullet pad 12、泪滴盘：teardrop pad 13、雪人盘：snowman pad 14、 v形盘：v-shaped pad 15、环形盘：annular pad 16、非圆形盘：non-circular pad 17、隔离盘：isolation pad 18、非功能连接盘：monfunctional pad 19、偏置连接盘：offset land 20、腹（背）裸盘：back-bard land 21、盘址：anchoring spaur 22、连接盘图形：land pattern 23、连接盘网格阵列：land grid array 24、孔环：annular ring 25、元件孔：component hole 26、安装孔：mounting hole 27、支撑孔：supported hole 28、非支撑孔：unsupported hole 29、导通孔：via 30、镀通孔：plated through hole (pth) 31、余隙孔：access hole 32、盲孔：blind via (hole) 33、埋孔：buried via hole 34、埋/盲孔：buried /blind via 35、任意层内部导通孔：any layer inner via hole (alivh) 36、全部钻孔：all drilled hole 37、定位孔：toaling hole 38、无连接盘孔：landless hole 39、中间孔：interstitial hole 40、无连接盘导通孔：landless via hole 41、引导孔：pilot hole 42、端接全隙孔：terminal clearomee hole 43、准表面间镀覆孔：quasi-interfacing plated-through hole 44、准尺寸孔：dimensioned hole 45、在连接盘中导通孔：via-in-pad 46、孔位：hole location 47、孔密度：hole density 48、孔图：hole pattern 49、钻孔图：drill drawing 50、装配图：assembly drawing 51、印制板组装图：printed board assembly drawing 52、参考基准：datum referance。
PCB专业英语词汇
PCB专业英语词汇一．Process 工艺流程1．Board cut /开料2．Drill /钻孔3．IQC(Incoming Quality Control) /来料检查4．PTH(Plated Through Hole) /沉铜5．Panel Plating /整板电镀6．D/F(Dry Film) /干膜7．Pattern Plating /图形电镀8．ETCH /蚀刻9．QC (Quality Control) /品质检查10.W/F(Wet Film) /湿膜11.Legend /字符12.HAL(Hot Air Leveling) /喷锡13.Immersion gold (chemical gold) /沉金14.Routing /锣15.V-CUT /V刻16.Punting /啤17.Rinse /清洗18.FQC(Final Quality Control) /终检19.QA Audit /审核20.Package /包装21.Shipment /出货ship out二．The items For QA1.PQC(Process Quality Control) /过程品质检查2.IPQC(In Process Quality Control) /过程控制检查3.First Article check /首件检查4.Backlight /背光检查5.Microsection /切片检查6.Etch Factor /蚀刻系数7.Tape test /胶纸实验8.Lot check /批检9.Full check /全检10.Sampling check /抽检11.Customer /客户12.Date code /日期代码13.AQL level(Average Quality Level) /AQL水平14.Sample size /抽样数15.Lot size /批量数16.Visual check /目视检查17.Logo /商标18.Solder side /焊接面ponent side /元件面20.Gold tape test /金层结合力实验21.S/M tape test /绿油结合实验22.C/M tape test /字符结合实验23.Impedance test /阻抗测试24.Wetting test(solder ability test) /可焊性实验25.Specimen 样板，样品26.Outgoing Report(shipment report) 出货报告27.ACC(Accepted) 可接受28.Rej (Rejected) 拒收29.Pass 过30.UAI(Use As Is) 特采（让步接受）31.Defect 缺陷32.Corrective Actions 纠正措施33.MRB(Material Review Bcard) 物料审核委员会34.Customer Complain 客户投诉35.DCC(Document Control Center) 文控中心三．The items for Engineering Department1.Engineering Department工程部2.QE: Quality Engineering 品质工程师3.MI: Manufacturing Instruction生产指引4.ECN: Engineering Change notice 工程变更通知5.Template 模板6.E/T Fixture测试架7.Ground Layer地层8.Inner Layer内层9.Dummy Pad(inner layer)假PAD10.Artwork Check11.Pattern12.Pattern Artwork13.S/M Artwork14.Legend Artwork字符非林15.Carbon Artwork16.CAD: Computer Assistant Design17.CAM: Computer Assistant Manufacturing18.MI Audit19.Tolerance20.Second Drill21.Tenting22.certificate / 证书23.clear / 清除24.client / 客户25.samples 样板/样品四．Y ear or week and month1.week:星期2.Monday1:星期3.Tuesday4.Wednesday5.Thursday6.Friday7.Saturday8.Sunday/first day9.month:月10.January 1月11.February 2月12.March 3月13.April 4月14.May 5月15.June 6月16.July 7月17.August 8月18.September 9月19.October 10月20.November 11月21.December 12月五Other one glossary1. Guarantee 保证2. Calibration 刻度3. hole 孔，洞。
PCB术语中英文对照表
PCB术语中英文对照表下面是一些常见的PCB术语的中英文对照表：1. PCB (Printed Circuit Board) - 印刷电路板2. PWB (Printed Wiring Board) - 印刷布线板3. FR4 (Flame Retardant 4) - 阻燃44. SMT (Surface Mount Technology) - 表面贴装技术5. THT (Through-Hole Technology) - 过孔技术6. BGA (Ball Grid Array) - 球栅阵列7. QFP (Quad Flat Package) - 四边平封装8. DIP (Dual Inline Package) - 双列直插封装9. SMD (Surface Mount Device) - 表面贴装元件10. CEM (Composite Epoxy Material) - 复合环氧材料11. HASL (Hot Air Solder Leveling) - 热空气焊锡平整12. OSP (Organic Solderability Preservatives) - 有机焊接性保护剂13. ENIG (Electroless Nickel Immersion Gold) - 无电镀镍浸金14. OSP (Organic Solderability Preservative) - 有机焊接性保护剂15. DRC (Design Rule Check) - 设计规则检查16. EMI (Electromagnetic Interference) - 电磁干扰17. EMC (Electromagnetic Compatibility) - 电磁兼容性18. NPTH (Non-Plated Through Hole) - 非电镀过孔19. PTH (Plated Through Hole) - 电镀过孔20. RoHS (Restriction of Hazardous Substances) - 有害物质限制21. UL (Underwriters Laboratories) - 美国安全实验室22. IPC (Institute for Interconnecting and Packaging Electronic Circuits) - 集成电路互连与封装协会这些是一些常见的PCB术语，希望对你有帮助！。
PCB工程部专业英语词汇
实用文档PCB 工程部专业英文词汇词汇1.板料: material2.最低限度: minimum 或者min.3.最大限度: maximum 或者max.4.基准点(零点) datum point5.周期Date code6.V-cut余厚V-cut remain thickness7.抢电铜皮〔假铜〕dummy copper8.实物板actual board9.外形及尺寸错误dimension error10.异常情形error data file11.焊锡面与零件面对位偏差misregistration12.孔塞plug hole13.要求requirement14.缺少miss15.偏公差uneven tolerance16.补偿compensation17.外表处理surface treatment18.无铅喷锡Lead free HAL19.金手指斜边bevel of G/F20.制程能力process capability21.建议,暗示suggest22.确保ensure23.满足,到达meet24.为了in order to25.交货期delivery date26.绿油桥solder mask bridge 或者solder mask dam27.根据according to 28.单边3mil per side 3 mil29.直径diameter30.半径radius31.小于3mil less than 3mil32.高于3mil more than 3 mil33.压合结构stacking structure 或者stack_up34.附件：attached file35.样品：sample36.文档：Document37.答复：answer; reply38.规格：spec39.与...同样的：the same as40.前版本：previous version(old version)41.生产：production42.确认：confirm43.再次确认：confirm again44.工程问题：engineering query〔EQ〕45.尽快：as soon as possible46.生产文件：production Gerber47.联系某人：contact somebody48.提交样板：submit sample49.交货期：delivery date50.电测本钱：ET〔electrical test〕cost51.通断测试：Open and short testing52.参考：refer to53.IPC标准：IPC standard54.IPC二级：IPC class 255.可接受的：acceptable56.允许：permit57.制造：manufacture 或者fabricate实用文档58.修改：revision59.公差：tolerance60.忽略：ignore61.工具孔：tooling hole62.安装孔：mounting hole63.元件孔：component hole64.槽孔：slot hole65.邮票孔：snap off hole 或者stamp hole66.导通孔：via hole67.盲孔：blind via hole68.埋孔：buried via hole69.金属化孔：PTH(plated through hole)70.非金属化孔：NPTH( no plated through hole)71.孔位：hole location72.防止：avoid73.原设计：original design74.修改：modify75.按原设计：follow up original design76.附边：waste tab, waste area 或者breakaway tab77.铜条：copper strip78.拼板：panel drawing79.板厚：board thickness80.删除：remove(delete)81.削铜：shave the copper82.露铜：copper exposure 或者exposed copper83.光标点: fiducial mark84.不同：be different from(differ from)85.内弧：inside radius86.焊环：annular ring87.单板尺寸：single size 88.拼板尺寸：panel size89.铣,锣：routing90.铣刀：router 或者Routing bit91.楔形掏槽V-cut 或者V scoring92.哑光：matt93.光亮的：glossy94.锡珠：solder ball(solder plugs)95.阻焊：solder mask(solder resist)96.阻焊开窗：solder mask opening97.单面开窗：single side mask opening98.补油：touch up solder mask99.补线：track welds100.毛刺：burrs101.去毛刺：deburr102.镀层厚度：plating thickness103.清洁度：cleanliness104.离子污染：ionic contamination105.阻燃性等级：flammability retardant rating 106.黑化：black oxidation107.棕化：brown oxidation108.红化：red oxidation109.可焊性不良：poor solderability110.焊料：solder111.包装：packaging112.角标：corner mark113.特性阻抗：characteristic impedance 114.正像：positive115.负片：negative116.镜像：mirror117.线宽：line width 或者trace width实用文档118.线距：line spacing 或者trace spacing119.做样：build sample120.按照：according to121.成品：finished122.做变更：make the change123.相类似：similar to124.规格：specification125.下移：shift down126.垂直地：vertically127.水平的：horizontally128.增大：increase129.缩小：decrease130.外表处理：Surface Finishing131.波峰焊：wave solder132.钻孔数据：drilling data133.标记：Logo134.Ul 标记：UL logo,或者Ul Marking135.蚀刻标记：etched marking136.周期：date code137.翘曲：bow and twist138.外层：outer layer 或者external layer139.内层：inner layer 或者internal layer140.顶层：top layer141.底层：bottom layer142.元件面：component side143.焊接面：solder side144.阻焊层：solder mask layer145.字符层：legend layer (silkscreen layer or over layer) 146.兰胶层：peelable SM layer147.贴片层：paste mask layer 148.碳油层：carbon layer149.外形层：outline layer(profile layer)150.白油：white ink151.绿油：green ink152.喷锡：hot air leveling (HAL)153.电金,水金：flash gold154.插头镀金：plated gold edge-board contacts 155.金手指：Gold-finger156.防氧化：Entek (OSP)157.沉金：Immersion gold (chem. Gold)158.沉锡：Immersion Tin(chem.Tin)159.沉银：Immersion Silver (chem. silver) 160.单面板：single sided board161.双面板：double sided board162.多层板：multilayer board163.刚性板：rigid board164.挠性板：flexible board165.刚挠板：flex-rigid board166.铣：CNC (mill , routing)167.冲：punching168.倒角：beveling169.斜面：chamfer170.倒圆角：fillet171.尺寸：dimension172.材料：material173.介电常数：Dielectric constant174.菲林：film175.成像：Imaging176.板镀：Panel Plating177.图镀：Pattern Plating实用文档178.后清洗：Final Cleaning179.叠层：stacking structure (stack-up) 180.污染焊盘：contaminate pad181.分孔图：drill chart 或者drill map 182.度数：degree183.被…覆盖：be covered with184.负公差：minus tolerance185.标靶盘：target pad186.外形公差：routing tolerance 187.芯板：core188.半固化片Prepreg189.阻抗线：impedance trace190.评估estimate191.玻纤显露Fiber Exposure192.底铜base copper193.工作搞working Gerber194.原稿original art work195.放宽relax196.挖空blanking 或者cut-out 197.一般性阻焊油墨general resist ink 198.孔位错误mis hole location 199.压合周期press cycle200.毛边serrated edges201.跳印skip printing202.气泡blistering203.隔离焊盘isolated pad204.泪滴tear drops205.箭头arrows206.加大Enlarge207.压合周期press cycle 208.毛边serrated edges209.跳印,漏印skip printing210.宽度与厚度的比值width-to-thickness ratio 211.调整adjust212.铜箔基板copper claded laminates213.线路露铜copper exposure214.孔内异物dirty hole215.椭圆形elliptical set216.纤维突出fiber protrusion217.填充料filler218.互相连通interconnection219.改善方案implementation220.板料使用率material use factor221.回路,网络network222.缺口nick223.氧化oxidation224.剥离(剥落) peeling off225.补线不良poor touch-up226.品质等级quality classification227.对位孔registration228.拒收rejectable229.树脂含量resin content230.排列电阻resistor network231.锣刀〔铣刀〕routing bit232.孔内沾文字S/L on hole233.孔内绿漆S/M on hole234.线路沾锡solder on trace235.金手指沾锡solder on G/F236.废框scrap237.封孔处理sealing实用文档238.间距缺乏spacing non-enough239.靶位孔target hole240.测试线路test circuit241.热应力试验thermal stress242.厚度分布thickness distribution243.薄基板,内层板thin core244.线路缺口及针孔track nick & pin hole245.裁切线trim line246.真平整true leveling247.真正位置的孔true position248.万用型universal249.气化室vaporizer250.仓库warehouse251.契尖角wedge angle252.线细width reduce253.良率yield254.渗铜,渗入,灯芯效应wicking255.允收acceptable256.试样点coupon location257.经核准的，被认可的approved258.超越胜过,超过其他exceed259.牛皮纸kraft paper260.孔壁破铜Hole void261.孔位破出Hole breakoutPCB生产—经典流程—英文培训教程A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size) B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination) c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)实用文档e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 外表刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating) i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子剩余量测试(Ionic Contamination Test )(Cleanliness Test)m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)实用文档N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation)N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣(Desmear)N-8 微蚀(Microetching )。
中英文对照的PCB专业用语
中英文对照地PCB 专业用语作者：深圳村村长 分类：英汉词汇大全 提交日期：2007-4-2 20:41:00 访问量：366综合词汇1、印制电路：printed circuit 2、印制线路：printed wiring 3、印制板：printed board 4、印制板电路： printed circuit board (pcb> 5、印制线路板： printed wiring board(pwb> 6、印制元件： printed component 7、印制接点： prin ted con tact 8、印制板装配： printed board assembly 9、 板：board单面印制板： sin gle-sided prin ted board(ssb> 双面印制板：double-sided prin ted board(dsb> 多层印制板： mulitlayer prin ted board(mlb> 多层印制电路板： mulitlayer prin ted circuit board 多层印制线路板： mulitlayer prited wiri ng board 刚性印制板：rigid prin ted board rigid sin gle-sided prin ted borad rigid double-sided prin ted borad rigid multilayer prin ted board flexible multilayer prin ted board挠性印制板：flexible printed board 挠性单面印制板：flexible si ngle-sided printed board22、 挠性双面印制板：flexible double-sided printed board 23、 挠性印制电路：flexible printed circuit (fpc> 24、挠性印制线路：flexible printed wiring 25、冈H 性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided prin ted 27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer prin ted board 28、齐平印制板：flush printed board 29、金属芯印制板：metal core printed board 30、 金属基印制板：metal base printed board31、 多重布线印制板：mulit-wiri ng prin ted board 32、 陶瓷印制板： ceramic substrate printed board33、 导电胶印制板： electroconductive paste printed board 34、模塑电路板：molded circuit board 35、 模压印制板： stamped printed wiring board10、 11、 12、 13、14、15、 16、17、 18、 19、 20、 21、 刚性单面印制板 刚性双面印制板 刚性多层印制板 挠性多层印制板36、顺序层压多层印制板：sequentially-laminated mulitlayer、 散线印制板： discrete wiri ng board 、 微线印制板： micro wire board 、 积层印制板： buile-up prin ted board 、 积层多层印制板： build-up mulitlayer prin ted board (bum> 、 积层挠印制板：build-up flexible prin ted board 、 表面层合电路板： surface lam inar circuit (slc> 、埋入凸块连印制板：b2it pri nted board 、 多层膜基板： multi-layered film substrate(mfs>、层间全内导通多层印制板：alivh multilayer prin ted board 、载芯片板：chip on board (cob> 、埋电阻板：buried resista nee board 、母板：mother board 、子板：daughter board 、背板：backplane 、裸板：bare board 、键盘板夹心板：copper- inv ar-copper board 、动态挠性板：dyn amic flex board 、静态挠性板：static flex board 、可断拼板：break-away pla nel 、电缆：cable 、挠性扁平电缆：flexible flat cable (ffc> 、薄膜开关：membra ne switch 、混合电路：hybrid circuit 、厚膜：thick film 、厚膜电路：thick film circuit 、薄膜：thin film 、薄膜混合电路：thin film hybrid circuit 、互连：interconnection 、导线：con ductor trace line 、齐平导线：flush conductor 、传输线：transmission line 、跨交：crossover 、板边插头：edge-board contact 、增强板：stiffener 、基底：substrate 、基板面：real estate 、导线面：con ductor side 、元件面：component side 、焊接面：solder side 、印制：printing 、网格：grid 、图形：pattern3738394041424344 4546 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 787980、导电图形：con ductive pattern、非导电图形：non-con ductive pattern81、字符：lege nd82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl>5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad lam in ate10、金属基覆铜层压板：metal base copper-clad lam in ate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bon di ng sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、力卩成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed lam in ate21、涂胶催化层压板：adhesive-coated catalyzed lami nate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bon di ng layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay>28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：un clad lami nate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：len gth wise direct ion37、模向：cross wise direct ion38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phe no lie cellulose paper copper-clad lami nates(phe nolic/paper ccl>40、环氧纸质覆铜箔板：epoxide cellulose paper copper-cladlam in ates (epoxy/paper ccl>41、环氧玻璃布基覆铜箔板：epoxide wove n glass fabric copper- cladlam in ates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glasscloth surfaces copper-clad lam in ates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glassrein forced copper-clad lam in ates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper- cladlam in ates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-cladlam in ates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triaz in e/epoxidewove n glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-cladlam inates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-cladlam in ates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad lam in ates51、紫外线阻挡型覆铜箔板：uv block ing copper-clad lami nates三、基材地材料1、 a 阶树脂：a-stage res in2、 b 阶树脂：b-stage res in3、 c 阶树脂：c-stage res in4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide res in8、双马来酰亚胺三嗪树脂：bismaleimide-triazi ne res in9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfu ncti onal epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silic one res in16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetti ng res in24、热塑性树脂：thermoplastic res in25、感光性树脂：photose nsitive res in26、环氧当量：weight per epoxy equivale nt (wpe>27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curi ng age nt32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi>38、聚四氟乙烯：polytetrafluoetylene (ptfe>39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep>40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e 玻璃纤维：e-glass fibre43、 d 玻璃纤维：d-glass fibre44、s 玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：wav in ess67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：coupli nt age nt77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil>90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil>93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：res in coated copper foil (rcc>96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔<剖面)轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stai n proofi ng104、双面处理铜箔：double treated foil设计 原理图：shematic diagram 逻辑图：logic diagram 印制线路布设：printed wire layout 布设总图：master draw ing 可制造性设计：desig n-for-ma nu facturabilitycomputer-aided desig n.(cad> computer-aided manu facturi ng.(cam> computer in tegrat manu facturing.(cim> computer-aided engin eeri ng.(cae> computer-aided test.(cat>electric design automation .(eda> engin eeri ng desig n automat on .(eda2> assembly aided architectural desig n. (aaad> computer aided draw ing computer con trolled display .(ccd>布局：placement 布线：routing 布图设计：layout重布：rerouting 模拟：simulation 逻辑模拟：logic simulatio n 电路模拟：circit simulation 时序模拟：timing simulation 模块化：modularization 布线完成率：layout effecie ncy机器描述格式： mach ine descripti onm format .(mdf> 机器描述格式数据库：mdf databse 设计数据库：desig n database 设计原点：desig n origi n 优化 <设计)：optimization (design> 供设计优化坐标轴：predo minant axis 表格原点：table origin 镜像： mirroring 驱动文件：drive file 中间文件：in termediate file 制造文件：manufacturing documentation 队歹U 支撑数据库： queue support database 元件安置：comp onent positi oning 图形显示：graphics dispaly 比例因子：scaling factor 扫描填充：sca n filli ng 矩形填充：recta ngle filli ng 填充域：region filling 四、1、2、3、4、5、 6、 7、 8、 9、 10、 11、 12、 13、 14、15、 16、 17、 18、 19、 20、 21、 22、 23、 24、25、26、27、28、29、30、31、32、33、34、35、36、37、38、39、40、41、42、43、计算机辅助设计: 计算机辅助制造: 计算机集成制造:计算机辅助工程: 计算机辅助测试 电子设计自动化 工程设计自动化 组装设计自动化 计算机辅助制图 计算机控制显示、实体设计：physical desig n 、逻辑设计：logic desig n 、 逻辑电路：logic circuit 、层次设计：hierarchical desig n 、 自顶向下设计：top-dow n desig n 、 自底向上设计： bottom-up desig n 、 线网：net 、数字化：digitzing 、设计规贝 U 检查：desig n rule check ing 、走 <布）线器：router （cad>、 网络表：net list 、 计算机辅助电路分析： computer-aided circuit an alysis 、 子线网：sub net 、 目标函数：objective function 、设计后处理： post desig n process ing （pdp> 、交互式制图设计：in teractive draw ing desig n 、 费用矩阵：cost metrix 、工程图：engineering drawing 、 方块框图：block diagram 、迷宫：moze、元件密度：comp onent den sity 、 巡回售货员问题：traveli ng salesma n problem 、 自由度：degrees freedom 、 入度：out going degree 、 出度：incoming degree 、曼哈顿距离：man hatt on dista nee 、欧几里德距离：euclidea n dista nee 、网络：network 、阵列：array 、段: segment 、逻辑：logic 、 逻辑设计自动化：logic desig n automati on 、分线：separated time 、分层：separated layer 、定顺序：definite sequenee形状与尺寸： 导线 <通道）：con duct ion （track> 导线 <体）宽度：con ductor width导线距离：con ductor spaci ng 导线层：con ductor layer 导线宽度 / 间距：con ductor lin e/space 第一导线层： con ductor layer n o.1 44 45 46 47 48 49 50 51 52 53 545556 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78五、 1、 2、 3、 4、 5、6、7、8、圆形盘：round pad 方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v 形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹<背)裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孑L环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth>31、余隙孔：access hole32、盲孔：blind via (hole>33、埋孔：buried via hole34、埋/ 盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh>36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：Iandless hole39、中间孔：interstitial hole40、无连接盘导通孔：Iandless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：prin ted board assembly drawing52、参考基准：datum referanee b5E2RGbCAP。
PCB专业术语中英文翻译
PCB专业术语中英文翻译很多PCB的书上使用的是英文，但是大多数的人又看不懂英文，这时候怎么办呢，我们需要翻译，但是如果每看到一个不会的词儿就去翻译，那么就太耗费时间了，所以我们捷多邦总结了一些常用的专业术语的中英文对照，希望能对大家有用。
1.印制电路：printed circuit2.印制线路：printed wiring3.印制板：printed board4.印制板电路：printed circuit board (pcb)5.印制线路板：printed wiring board(pwb)6.印制元件：printed component7.印制接点：printed contact8.印制板装配：printed board assembly9.板：board 110.表面层合电路板：surface laminar circuit (slc)11.埋入凸块连印制板：b2it printed board12.多层膜基板：multi-layered film substrate(mfs)13.层间全内导通多层印制板：alivh multilayer printed board14.载芯片板：chip on board (cob)15.埋电阻板：buried resistance board16.母板：mother board17.单面印制板：single-sided printed board(ssb)18.双面印制板：double-sided printed board(dsb)19.多层印制板：mulitlayer printed board(mlb)20.多层印制电路板：mulitlayer printed circuit board21.多层印制线路板：mulitlayer prited wiring board22.刚性印制板：rigid printed board23.刚性单面印制板：rigid single-sided printed borad24.刚性双面印制板：rigid double-sided printed borad25.刚性多层印制板：rigid multilayer printed board26.子板：daughter board27.背板：backplane28.裸板：bare board29.键盘板夹心板：copper-invar-copper board30.动态挠性板：dynamic flex board31.静态挠性板：static flex board32.可断拼板：break-away planel33.电缆：cable34.挠性扁平电缆：flexible flat cable (ffc)35.薄膜开关：membrane switch36.混合电路：hybrid circuit37.厚膜：thick film38.厚膜电路：thick film circuit39.薄膜：thin film40.挠性多层印制板：flexible multilayer printed board41.挠性印制板：flexible printed board42.挠性单面印制板：flexible single-sided printed board43.挠性双面印制板：flexible double-sided printed board44.挠性印制电路：flexible printed circuit (fpc)45.挠性印制线路：flexible printed wiring46.刚性印制板：flex-rigid printed board, rigid-flex printedboard47.刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed48.刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board49.齐平印制板：flush printed board50.金属芯印制板：metal core printed board51.金属基印制板：metal base printed board52.多重布线印制板：mulit-wiring printed board53.陶瓷印制板：ceramic substrate printed board54.导电胶印制板：electroconductive paste printed board55.模塑电路板：molded circuit board56.模压印制板：stamped printed wiring board57.顺序层压多层印制板：sequentially-laminated mulitlayer58.散线印制板：discrete wiring board59.微线印制板：micro wire board60.积层印制板：buile-up printed board61.积层多层印制板：build-up mulitlayer printed board (bum)62.积层挠印制板：build-up flexible pr上面是一些比较常见的专业用语，有一些不是特别常用的有时候我们也会遇到，所以我们捷多邦也总结了一些不怎么常用的中英文对照，希望对你来说是有用的：1.Absorption 吸收、吸入2.Accelerated Test（Aging）加速试验、加速老化3.Accelerator 加速剂、速化剂4.Accept/Acceptance 允收5.Acceptable Quality Level（AQL）允收品质水准6.Accuracy 准确度ACF：7.Adhesive copper foil 有胶铜箔8.Activator 活化剂、添加剂比称为9.Activator Active parts（Devices）主动零件，指积体电路或电晶体10.Addition Agent 添加剂11.Additive Process 加成法、分全加成、半加成及部份加成12.Back Light（Back Lighting）背光法13.Back-UP 垫板14.Backpanels/ Backplanes 背板、支持板，厚度较厚，15.Ball Grid Array（BGA）球脚车列（封装）16.Barrel 孔壁17.Base Material 基材18.Batch 批（同时间发料某一数量的板子）19.Bevelling 切斜边20.Binder 黏结剂21.Capacitance 电容22.Carbide 碳化物、碳化钨钻头23.CAR: Corrective Action Report 改善报告24.Carbon Treatment 活性碳处理25.Card 卡板26.Carrier 载体27.Cartridge 滤芯28.Cathode 阴极L: Copper Clad Laminates 铜箔基板30.Ceramics 陶瓷31.Certificate 证明书32.CFC 氟氯碳化物33.Chloro-Fluoro-Carbon Chamfer 倒角、去掉直角34.Characteristic Impedance 特性阻抗35.Cheek list 检察清单36.Chip 晶粒、晶片37.Chip On Board 晶片黏著板38.Clean Room 无尘室(Class 100)39.Cleanliness 清洁度40.Clearance 余隙、余环41.COB（Chip on Board）晶片在板上直接组装42.COC（Certificate of Compliance）出货合格书。
中英文对照的PCB专业用语
中英文对照的PCB专业用语protel/blue sky 发表于2006-06-04, 10:16一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed boa rd26、刚性双面印制板：flex-rigid double-sided printed board, rigid -flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-f lex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad lamin ates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad lamina tes (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-cladlaminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glas s cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glas s reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/ep oxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric coppe r-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad lam inates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copoly mer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
PCB专业术语翻译(英语)
PCB专业术语（英语）PCB printed circuit board 印刷电路板，指空的线路板PCBA printed circuit board assembly 印刷电路板组件，指完成元件焊接的线路板组件PW A Printed Wire Assembly，Aperture list Editor：光圈表编辑器。
Aperture list windows：光圈表窗口。
Annular ring：焊环。
Array：拼版或陈列。
Acid trip：蚀刻死角。
Assemby：安装。
Bare Bxnel：光板，未进行插件工序的PCB板。
Bad Badsize：工作台，工作台有效尺寸。
Blind Buried via：盲孔，埋孔。
Chamfer：倒角。
Circuit：线路。
Circuit layer：线路层。
Clamshell tester：双面测试机。
Coordinates Area：坐标区域。
Copy-protect key：软件狗。
Coutour：轮廓。
Draw：一种圆形的光圈，但只是用于创建线路，不用于创建焊盘。
Drill Rack：铅头表。
Drill Rack Editor：铅头表编辑器。
Drill Rack window：铅头表窗口。
D Code：Gerber格式中用不着于表达光圈的代码。
Double-sided Biard：双面板。
End of Block character（EOB）：块结束符。
Extract Netlist：提取网络。
Firdacial：对位标记。
Flash：焊盘，来源于早期矢量光绘机，在矢量光绘机中，焊盘是光通过光圈“闪出”（Flash）而形成的。
Gerber Data：从PCB CAD系统到PCB生产过程中最常用的数据格式。
Grid ：栅格。
Graphical Editor：图形编辑器。
Incremental Data：增量数据。
Land：接地层。
Layer list window：层列表窗口。
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PCB专业术语（英语）PCB printed circuit board 印刷电路板，指空的线路板PCBA printed circuit board assembly 印刷电路板组件，指完成元件焊接的线路板组件PWA Printed Wire Assembly，Aperture list Editor：光圈表编辑器。
Aperture list windows：光圈表窗口。
Annular ring：焊环。
Array：拼版或陈列。
Acid trip：蚀刻死角。
Assemby：安装。
Bare Bxnel：光板，未进行插件工序的PCB板。
Bad Badsize：工作台，工作台有效尺寸。
Blind Buried via：盲孔，埋孔。
Chamfer：倒角。
Circuit：线路。
Circuit layer：线路层。
Clamshell tester：双面测试机。
Coordinates Area：坐标区域。
Copy-protect key：软件狗。
Coutour：轮廓。
Draw：一种圆形的光圈，但只是用于创建线路，不用于创建焊盘。
Drill Rack：铅头表。
Drill Rack Editor：铅头表编辑器。
Drill Rack window：铅头表窗口。
D Code：Gerber格式中用不着于表达光圈的代码。
Double-sided Biard：双面板。
End of Block character（EOB）：块结束符。
Extract Netlist：提取网络。
Firdacial：对位标记。
Flash：焊盘，来源于早期矢量光绘机，在矢量光绘机中，焊盘是光通过光圈“闪出”（Flash）而形成的。
Gerber Data：从PCB CAD系统到PCB生产过程中最常用的数据格式。
Grid ：栅格。
Graphical Editor：图形编辑器。
Incremental Data：增量数据。
Land：接地层。
Layer list window：层列表窗口。
Layer setup Area：层设置窗口。
Multilayer Board：多层板。
Nets：网络。
Net End：网络端点。
Net List：网络表。
Pad：焊盘。
Pad shaving：焊盘缩小。
Parts ：元件。
Plated Through Hole：电镀通孔。
Photoplotter：光绘机。
Polarity：属性。
Print Circuit Board（PCB）：印制线路板。
Programmable Dvice Fromat（PDF）：可编辑设备格式。
Probe Tester：针式测试机。
Query：询问。
Query window：询问窗口。
Resist：保护层。
Rotation：旋转。
RS-274-X：扩展Gerber.Single-sided-Board：单面板。
Solder mask：阻焊。
Solder Paste：助焊层。
Surface Maount Technology(SMT)：表面贴装技术。
Thermal pad：散热焊盘。
Test point：测试点。
Teardrop：泪滴。
Trace：线路。
User X.Y：用户坐标。
conduction (track) 导线（通道）conductor width导线（体）宽度conductor spacing导线距离conductor layer导线层conductor line space导线宽度间距conductor layer No.1第一导线层round pad圆形盘square pad方形盘diamond pad菱形盘oblong pad长方形焊盘bullet pad子弹形盘teardrop pad泪滴盘snowman pad雪人盘V-shaped pad V形盘annular pad环形盘non-circular pad非圆形盘isolation pad隔离盘monfunctional pad非功能连接盘offset land偏置连接盘back-bard land腹（背）裸盘anchoring spaur盘址land pattern连接盘图形land grid array连接盘网格阵列annular ring孔环component hole元件孔mounting hole安装孔supported hole支撑孔unsupported hole非支撑孔via hole导通孔plated through hole (PTH) 镀通孔access hole余隙孔blind via (hole) 盲孔buried via hole埋孔buried /blind via埋/盲孔any layer inner via hole (ALIVH) 任意层内部导通孔all drilled hole全部钻孔toaling hole定位孔landless hole无连接盘孔interstitial hole中间孔landless via hole无连接盘导通孔pilot hole引导孔terminal clearomee hole端接全隙孔quasi-interfacing plated-through hole准表面间镀覆孔dimensioned hole准尺寸孔via-in-pad在连接盘中导通孔hole location孔位hole density孔密度hole pattern孔图drill drawing钻孔图assembly drawing装配图printed board assembly drawing印制板组装图datum referan参考基准开孔面积百分率 open mesh area percentage 丝网所有网孔的面积与相应的丝网总面积之比，用百分数表示。
模版开孔面积 open stencil area 丝网印刷模版上所有图像区域面积的总和。
网框外尺寸 outer frame dimension 在网框水平位置上，测得包括网框上所有部件在内的长与宽的乘积。
印刷头 printing head 印刷机上通过靠着印版动作、为焊膏或胶水转移提供必要压力的部件。
印刷面 printing side(lower side) 丝网印版的底面，即焊膏或胶水与PCB板相接触的一面。
丝网 screen mesh 一种带有排列规则、大小相同的开孔的丝网印刷模版的载体。
丝网印刷 screen printing 使用印刷区域呈筛网状开孔印版的漏印方式。
印刷网框 screen printing frame 固定并支撑丝网印刷模版载体的框架装置。
离网 snap-off 印刷过程中，丝网印版与附着于PCB板上的焊膏或胶水的脱离。
刮刀 squeegee 在丝网印刷中，迫使丝网印版紧靠PCB板，并使焊膏或胶水透过丝网印版的开孔转移到PCB板上，同时刮除印版上多余焊膏或胶水的装置。
刮刀角度 squeegee angle 刮刀的切线方向与PCB板水平面或与压印辊接触点的切线之间的夹角，在刮刀定位后非受力或非运动的状态下测得。
刮刀 squeegee blade 刮刀的刀状部分，直接作用于印版上的印刷焊膏或胶水，使焊膏或胶水附着在PCB板上。
刮区 squeegeeing area 刮刀在印版上刮墨运行的区域。
刮刀相对压力 squeegee pressure, relative 刮刀在某一段行程内作用于印版上的线性压力除以这段行程的长度。
丝网厚度 thickness of mesh 丝网模版载体上下两面之间的距离。
Absolute Data：绝对数据，PCB数据的位置参数都是以系统的零点为基准进行测量的。
Absolute X、Y：绝对坐标，在绝对坐标系下当前光标的坐标位置。
Aperture：光圈，该名称来自于早期的矢量光绘机，在矢量光绘机中，图形是光通过“光圈盘”上不同形状和尺寸的“光圈”孔在感光材料（菲林）上曝光而形成的。
Aperture list：光圈表。
SMT名词解释AAccuracy(精度)：测量结果与目标值之间的差额。
Additive Process(加成工艺)：一种制造PCB导电布线的方法，通过选择性的在板层上沉淀导电材料(铜、锡等Adhesion(附着力)：类似于分子之间的吸引力。
Aerosol(气溶剂)：小到足以空气传播的液态或气体粒子。
Angle of attack(迎角)：丝印刮板面与丝印平面之间的夹角。
Anisotropic adhesive(各异向性胶)：一种导电性物质，其粒子只在Z轴方向通过电流。
Annular ring(环状圈)：钻孔周围的导电材料。
Application specific integrated circuit (ASIC特殊应用集成电路)：客户定做得用于专门用途的电路。
Array(列阵)：一组元素，比如：锡球点，按行列排列。
Artwork(布线图)：PCB的导电布线图，用来产生照片原版，可以任何比例制作，但一般为3:1或4:1。
Automated test equipment (ATE自动测试设备)：为了评估性能等级，设计用于自动分析功能或静态参数的设备，也用于故障离析。
Automatic optical inspection (AOI自动光学检查)：在自动系统上，用相机来检查模型或物体。
BBridge(锡桥)：把两个应该导电连接的导体连接起来的焊锡，引起短路。
Buried via(埋入的通路孔)：PCB的两个或多个内层之间的导电连接(即，从外层看不见的)。
CCAD/CAM system(计算机辅助设计与制造系统)：计算机辅助设计是使用专门的软件工具来设计印刷电路结构；计算机辅助制造把这种设计转换成实际的产品。
这些系统包括用于数据处理和储存的大规模内存、用于设计创作的输入和把储存的信息转换成图形和报告的输出设备Capillary action(毛细管作用)：使熔化的焊锡，逆着重力，在相隔很近的固体表面流动的一种自然现象。
Chip on board (COB板面芯片)：一种混合技术，它使用了面朝上胶着的芯片元件，传统上通过飞线专门地连接于电路板基底层。
Circuit tester(电路测试机)：一种在批量生产时测试PCB的方法。
包括：针床、元件引脚脚印、导向探针、内部迹线、装载板、空板、和元件测试。
Cladding(覆盖层)：一个金属箔的薄层粘合在板层上形成PCB导电布线。
Coefficient of the thermal expansion(温度膨胀系数)：当材料的表面温度增加时，测量到的每度温度材料膨胀百万分率(ppm)Cold cleaning(冷清洗)：一种有机溶解过程，液体接触完成焊接后的残渣清除。
Cold solder joint(冷焊锡点)：一种反映湿润作用不够的焊接点，其特征是，由于加热不足或清洗不当，外表灰色、多孔。