LCM工艺介绍
LCM Process Introduction
日期:2006.5.25
版本:V01
JI ENG Robert KUO Module JI
Process Introduction
Market Requirement High resolution
VGA?SVGA?XGA?SXGA
(640x480?800x600?1024x768?1280x1024) Light/Thin/Small
Narrow Glass Edge
Thinner
Light Weight
Low price
Low price PC
Low price parts
Low price LCD
LCD Module Process(JI +MA )TFT
Array 及
CF 組成
之Cell Assembly Assembly TFT LCD 模組成品TFT LCD
模組成品
Inspection Inspection Aging Aging Inspection Inspection Packing Packing JI MA COF bonding PCB bonding PCB(P rinted C ircuit B oard)
COF(C hip O n F ilm )(TAB: T ape A utomatic B onding )
Back Light
Bezel TFT
Array 及
CF 組成
之Cell TFT Array 及CF 組成之Cell
PCB PCB
PCB Test
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