74061-1002中文资料

J-20MX01

B a c k p l a n e

C o n n e c t o r S y s t e m s

FEATURES AND SPECIFICATIONS

2.00mm (.079") Pitch VHDM*

Board-to-Board Backplane Header 74061Vertical

8 Row Guide Pin Signal Module, Pin End Version

Features and Bene?ts

s Metal guide pin provides for ±1.67mm (.065") of mating capture

s Guide pin integrated into the header body (no other hard-ware needed)

s Coding hex key provides 8 different codes s 10 column and 25 column versions available s Stackable end to end for high density

s Ground planes between signal columns control impedance and reduce cross talk

s Press-?t construction eliminates solder defects, allows use of thicker PCBs without worrying about solder tail length s High-temperature plastic housings are Surface Mount

Electrical Voltage: 250V Current: 1.0A

Contact Resistance: See table of resistance by row on page 8Dielectric Withstanding Voltage: 750V Insulation Resistance: 10,000 M ? min. Mechanical

Insertion Force: 45N max. per press-fit pin Retention Force: 9N min. per press-fit pin Mating Force: 0.40N nominal per press-fit pin Unmating Force: 0.15N min. per press-fit pin Signal Normal Force: 0.5N min. ORDERING INFORMATION AND DIMENSIONS

Note: Other codes are available. Please contact Molex for more information.

Circuits Order No.Termination Dimension

No Code Code A Code B A

B M

8074061-100174061-101174061-1021Press-Fit 27.00(1.063)18.00(.709) 4.75(.187)8074061-100274061-101274061-1022Press-Fit 27.00(1.063)18.00(.709) 6.25(.246)20074061-250174061-251174061-2521Press-Fit 57.00(2.244)48.00(1.890) 4.75(.187)200

74061-2502

74061-2512

74061-2522

Press-Fit

57.00(2.244)

48.00(1.890)

6.25(.246)

* Very High Density Metric and VHDM are trademarks of Teradyne, Inc.

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