SDIO接口模式WIFI模块规格书

WiFi-microSD 802.11b/g/n Module

Product Datasheet Preliminary V0.1

Shenzhen Netcom Electronics Co.,Ltd.

2011-02-22

All rights are reserved by Shenzhen Netcom. Not allowed to be reproduced in any form without permission of Netcom. Subject to change without notice.

Table of Contents

1. Product Revision History (3)

2. General Description (4)

2.1 Block Diagram (4)

2.2 Key Features (4)

3. Dimensions and Footprint (5)

4. Technical Specifications (8)

4.1 Absolute Maximum Rating (8)

4.2 Recommendable Operation Condition (8)

4.2.1 General DC Electrical Characteristics(For 3.3V I/O Operation) (9)

4.5 Typical Power Consumption performance (9)

4.5.1 Typical Current Consumption [2.4GHz operation]-Continuous Receive (9)

4.5.2 Typical Current Consumption [2.4GHz operation]-Continuous Transmit (9)

5. I/O Characteristics (10)

5.1 SDIO timing characteristics (10)

6.2 SPI timing characteristics (12)

7. Application Reference Design (12)

8. Package Information (12)

8.1 Marking (12)

8.2 Package Dimension (13)

8.3 Laser Mark (13)

9. Ordering Information (13)

1. Product Revision History

Version No.

Revised Date

Revised by

Description Notes

V0.1 2011-02-22 Min.Q Preliminary specification draft

2. General Description

WiFi-microSD Module for 2.4 GHz Embedded WLAN Applications WiFi-microSD is 802.11b/g/n Wireless microSD Module which provides 802.11b/g/n WiFi access, which is optimized for cell phones, MIDs,PDAs, Multimedia players and other portable devices. WiFi-microSD is a highly integrated module, it integrated LNA, PA, Antenna and other necessary components. The WiFi-microSD provides multiple peripheral interfaces including SDIO, GSPI.

WiFi-microSD is available in the standard microSD package with size by 11.0mm x 15.0mm x 0.7mm, and it is RoHS compliant and 100% lead (pb) free.

2.1 Block Diagram

A simplified block diagram of the WiFi-microSD module is depicted in the figure below.

2.2 Key Features

■Data Rates: 1, 2, 5.5, 6, 9, 11, 12, 18, 24, 36, 48, 54 (IEEE 802.11 b/g/n-compliant)

■Modulation: QPSK, 16QAM, 64QAM DBPSK, DQPSK, CCK, OFDM with BPSK

■WEP and AES hardware encryption accelerator up to 256 bits

■Interface: SPI/SDIO

■Leading-edge low power consumption

■RoHS Compliant

■ standar microSD package.

3. Dimensions and Footprint

This section provides the dimensions and footprint of the WiFi-microSD. Figure 1-1 shows the contact pad view of the WiFi-microSD.

Figure 1-1.Contact Pad View

SD Mode SPI Mode

Pin#

Name Type Description Name Type Description 1 DAT2 I/O/PP Data

Line[Bit2] RSV

2 CD/DAT

3 I/O/PP Card Detect/Data

Line[Bit3]

CS I Chip

Select(neg

true)

3 CMD PP Command/Response DI I Data

In

4 VDD S Supply voltage VDD S Supply voltage

5 CLK I Clock SCLK I Clock

6 VSS S Supply voltage ground VSS S Supply voltage ground

7 DAT0 I/O/PP Data Line[Bit0] DO O/PP Data Out

8 DAT1 I/O/PP Data

Line[Bit1] RSV

Table 1-1.Contact Pad Description

Figure 1-2. Mechanical Description: Top View

Figure 1-3.Mechanical Description: Bottom View

COMMON DIMENSIONS COMMON DIMENSIONS SYMBOL MIN NOM MAX NOTE SYMBOL MIN NOM MAX NOTE

A 10.90 11.00 11.10B11 1.1 1.2 1.3

A1 9.60 9.70 9.80 B12 3.6 3.7 3.8

A2 - 3.85 - BASIC B13 2.8 2.9 3

A3 7.60 7.70 7.80 B14 8.2 - -

A4 - 1.10 - BASIC B15 - - 6.2

A5 0.75 0.80 0.85 C 0.9 1 1.1

A6 - - 8.50 C1 0.6 0.7 0.8

A7 0.90 - - C2 0.2 0.3 0.4

A8 0.60 0.70 0.80 C3 0 - 0.15

A9 0.80 - - D1 1 - -

A10 1.35 1.40 1.45 D2 1 - -

A11 6.50 6.60 6.70 D3 1 - -

A12 0.50 0.55 0.60 R1 0.2 0.4 0.6

A13 0.40 0.45 0.50 R2 0.2 0.4 0.6

B 14.90 15.00 15.10R3 0.7 0.8 0.9

B1 6.30 6.40 6.50 R4 0.7 0.8 0.9

B2 1.64 1.84 2.04 R5 0.7 0.8 0.9

B3 1.30 1.50 1.70 R6 0.7 0.8 0.9

B4 0.42 0.52 0.62 R7 29.5 30 30.5

B5 2.80 2.90 3.00 R10 - 0.2 -

B6 5.50 - - R11 - 0.2 -

B7 0.20 0.30 0.40 R17 0.1 0.2 0.3

B8 1.00 1.10 1.20 R18 0.2 0.4 0.6

B9 - - 9.00 R19 0.05 - 0.2

B10 7.8 7.9 8 R20 0.02 - 0.15

Table 1-2. microSD Package: Dimensions

4. Technical Specifications

4.1 Absolute Maximum Rating

Rating

Unit Symbol(Domain) Parameter Max

VDD Main Power 0 to 3.6 V

I/O interface I/O voltage -0.3 to 3.6 V

T store Storage temperature ℃

discharge tolerance V

ESD Electrostatic

4.2 Recommendable Operation Condition

Unit

Max

Typ

Symbol(Domain) Parameter Min

Power 2.8 3.3 3.6 V

VDD Main

T amblent Ambient

temperature ℃

4.2.1 General DC Electrical Characteristics(For 3.3V I/O Operation)

Max

Typ

Unit

Min

Symbol Parameter Conditions

V IH High Level Input V oltage 0.25*VDD 3.6 V

V IL Low Level Input V oltage -0.3 0.25*VDD V

V OH High Level Output V oltage

0.75x VDD V

V OL Low Level Output V oltage 0.125*VDD

V 4.5 Typical Power Consumption performance

4.5.1 Typical Current Consumption [2.4GHz operation]-Continuous Receive

Typical Current Consumption[mA]

Mode/Rate[Mbps]

3.3V(VDD)

CCK, 1Mbps 41

CCK, 11Mbps 41

OFDM, 6Mbps 43

OFDM, 54Mbps 46

HT20, MCS0 45

HT20, MCS7 45

4.5.2 Typical Current Consumption [2.4GHz operation]-Continuous Transmit

Typical Current Consumption[mA]

Mode/Rate[Mbps]

3.3V(VDD)

CCK, 1Mbps 188

CCK, 11Mbps 186

OFDM, 6Mbps 180

OFDM, 54Mbps 174

HT20, MCS0 170

HT20, MCS7 150

5. I/O Characteristics

5.1 SDIO timing characteristics

The SDIO/SPI-interface can run in three different modes, SDIO 1-bit mode, SDIO 4-bit mode or in SDIO/SPI 1-bit mode. Timing can be set for Default speed mode or High speed mode.

SDIO 1-bit Default speed mode is selected at Power On Reset. The host can change mode by sending the corresponding command over the SDIO-interface.

The Default mode is showed in Figure 5-1 and Table 5-1. For the high speed mode see Figure 5-2 and Table 5-2. Condition: VDDIO_SDIO= 1.7 – 3.6 V, Tamb= -20 – +70°C

Figure 5-1. SDIO/SPI timing diagram (default mode)

Table 5-1.SDIO timing parameter values (default mode)

Figure 5-2. SDIO timing diagram (high speed mode)

Table 5-2.SDIO timing diagram (high speed mode)

6.2 SPI timing characteristics

The SPI interface is intended to be used for application specific purposes, like communicating with an external memory, display or codec. Note that this interface can not be used as a host interface. The timing characteristics are shown in Figure 6-3 and Table 6-3.

Figure 6-3. SPI timing diagram

Table 6-3.SPI timing parameter values

6. Application Reference Design

TBD

7. Package Information

7.1 Marking

TBD

7.2 Package Dimension

TBD

7.3 Laser Mark

TBD

8. Ordering Information

Shenzhen Netcom Technology Netcom Electronics Co., Ltd

Tel: +86-755-8616 8848 FAX: +86-755-8616 9388

Address: 8/F, 1 Building, Finance Base,No. 8, Kefa Road, High-Tech Park, Shenzhen, China